Inventor · disambiguated record
Jason Stephens
Also filed as: STEPHENS JASON · STEPHENS JASON M · STEPHENS JASON MICHAEL
13 granted patents·13 pending applications·10 citations·filing 2007–2024
84Inventor score
Files withWATLOW ELECTRIC MFG10THINSILICON CORP5ILLINOIS TOOL WORKS4THINSILICION CORP3COMPONENT RE ENG COMPANY INC1
Top patents by PatentIndex Score
26 records- 0182US10677473B2Oven with cleaning system and grease and water flow separationILLINOIS TOOL WORKS·Filed 2015·Granted Jun 9, 2020·7 cites·8 claims
- 0278US12128494B2Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2023·Granted Oct 29, 2024·0 cites·13 claims
- 0378US2025050439A1Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 0473US11993547B2Termination feedthrough unit with ceramic insulator for vacuum and corrosive applicationsWATLOW ELECTRIC MFG·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 0569US12020971B2Method for joining quartz pieces and quartz electrodes and other devices of joined quartzWATLOW ELECTRIC MFG·Filed 2021·Granted Jun 25, 2024·0 cites·15 claims
- 0669US10593584B2Electrostatic chuck for clamping in high temperature semiconductor processing and method of making sameCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Mar 17, 2020·1 cites·27 claims
- 0762US2025069943A1Hybrid shaft assembly for thermal control in heated semiconductor pedestalsWATLOW ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 0861US11222804B2Electrostatic chuck for clamping in high temperature semiconductor processing and method of making sameWATLOW ELECTRIC MFG·Filed 2020·Granted Jan 11, 2022·0 cites·20 claims
- 0961US2024404869A1Solid-state bonding method for the manufacture of semiconductor chucks and heatersWATLOW ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 1060US11648620B2Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2018·Granted May 16, 2023·0 cites·13 claims
- 1158US8444766B2System and method for recycling a gas used to deposit a semiconductor layerSTEPHENS JASON MICHAEL·Filed 2009·Granted May 21, 2013·2 cites·18 claims
- 1258US2011189811A1Photovoltaic device and method of manufacturing photovoltaic devicesTHINSILICON CORP·Filed 2011·Application pending·0 cites
- 1357US11183412B2Method for joining quartz pieces and quartz electrodes and other devices of joined quartzWATLOW ELECTRIC MFG·Filed 2018·Granted Nov 23, 2021·0 cites·20 claims
- 1456US2013295710A1Photovoltaic modules and methods for manufacturing photovoltaic modules having tandem semiconductor layer stacksTHIN SILICON CORP·Filed 2013·Application pending·0 cites
- 1555US2008295882A1Photovoltaic device and method of manufacturing photovoltaic devicesTHINSILICON CORP·Filed 2008·Application pending·0 cites
- 1654US12044415B2Convection ovenILLINOIS TOOL WORKS·Filed 2021·Granted Jul 23, 2024·0 cites·10 claims
- 1754US2010313952A1Photovoltaic modules and methods of manufacturing photovoltaic modules having multiple semiconductor layer stacksTHINSILICION CORP·Filed 2010·Application pending·0 cites
- 1854US2010313942A1Photovoltaic module and method of manufacturing a photovoltaic module having multiple semiconductor layer stacksTHINSILICION CORP·Filed 2010·Application pending·0 cites
- 1954US2014049282A1Lensing system and method for photovoltaic devicesSTEPHENS JASON·Filed 2012·Application pending·0 cites
- 2054US2010313935A1Photovoltaic modules and methods for manufacturing photovoltaic modules having tandem semiconductor layer stacksTHINSILICION CORP·Filed 2010·Application pending·0 cites
- 2149US11028021B2Termination feedthrough unit with ceramic insulator suitable for vacuum and corrosive applicationsWATLOW ELECTRIC MFG·Filed 2018·Granted Jun 8, 2021·0 cites·16 claims
- 2249US2011114156A1Photovoltaic modules having a built-in bypass diode and methods for manufacturing photovoltaic modules having a built-in bypass diodeTHINSILICON CORP·Filed 2010·Application pending·0 cites
- 2348US2013014800A1Photovoltaic device and method for scribing a photovoltaic deviceTHINSILICON CORP·Filed 2011·Application pending·0 cites
- 2447US2008072953A1Back contact device for photovoltaic cells and method of manufacturing a back contact deviceTHINSILICON CORP·Filed 2007·Application pending·0 cites
- 2541US10408463B2Oven with steam water separationILLINOIS TOOL WORKS·Filed 2015·Granted Sep 10, 2019·0 cites·16 claims
- 2635US10969113B2Oven with steam water flow directorsILLINOIS TOOL WORKS·Filed 2015·Granted Apr 6, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →