Inventor · disambiguated record
Yohko Mashimoto
Also filed as: MASHIMOTO YOHKO
5 granted patents·274 citations·filing 1996–1998
85Inventor score
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0195US6020561APrinted circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereofINTEL CORP·Filed 1996·Granted Feb 1, 2000·138 cites·4 claims
- 0279US6030854AMethod for producing a multilayer interconnection structureINTEL CORP·Filed 1998·Granted Feb 29, 2000·60 cites·19 claims
- 0373US5660321AMethod for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contactsINTEL CORP·Filed 1996·Granted Aug 26, 1997·31 cites·20 claims
- 0466US5880530AMultiregion solder interconnection structureINTEL CORP·Filed 1996·Granted Mar 9, 1999·31 cites·14 claims
- 0540US5811883ADesign for flip chip joint pad/LGA padINTEL CORP·Filed 1996·Granted Sep 22, 1998·14 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →