Inventor · disambiguated record
Jong Min Yook
Also filed as: YOOK JONG MIN
8 granted patents·6 pending applications·5 citations·filing 2014–2024
74Inventor score
Top patents by PatentIndex Score
14 records- 0182US9984950B2Semiconductor package and method for manufacturing the sameKOREA ELECTRONICS TECHNOLOGY·Filed 2017·Granted May 29, 2018·4 cites·9 claims
- 0265US12469944B2Waveguide package, method of manufacturing the same, and package housingKOREA ELECTRONICS TECHNOLOGY·Filed 2022·Granted Nov 11, 2025·0 cites·13 claims
- 0359US9899315B2Wiring for semiconductor device and method of forming sameKOREA ELECTRONICS TECHNOLOGY·Filed 2014·Granted Feb 20, 2018·1 cites·8 claims
- 0459US2024282724A1Antenna-integrated high-frequency semiconductor package and method of manufacturing sameKOREA ELECTRONICS TECHNOLOGY·Filed 2024·Application pending·0 cites
- 0557US2024395644A1Glass-based integrated circuit packages for compound microelectronic components operating at millimeter wave (mmwave) frequenciesCORNING INC·Filed 2024·Application pending·0 cites
- 0655US12014881B2High frequency capacitor and manufacturing method thereofKOREA ELECTRONICS TECHNOLOGY·Filed 2022·Granted Jun 18, 2024·0 cites·11 claims
- 0755US11658374B2Quasi-coaxial transmission line, semiconductor package including the same, and method of manufacturing the sameKOREA ELECTRONICS TECHNOLOGY·Filed 2020·Granted May 23, 2023·0 cites·10 claims
- 0852US2023107554A1Semiconductor package and manufacturing method thereofKOREA ELECTRONICS TECHNOLOGY·Filed 2022·Application pending·0 cites
- 0949US10170538B2MIS capacitorKOREA ELECTRONICS TECHNOLOGY·Filed 2017·Granted Jan 1, 2019·0 cites·12 claims
- 1048US11197372B2Capacitor having through hole structure and manufacturing method thereforKOREA ELECTRONICS TECHNOLOGY·Filed 2019·Granted Dec 7, 2021·0 cites·7 claims
- 1147US11538770B2Semiconductor package including passive device embedded therein and method of manufacturing the sameKOREA ELECTRONICS TECHNOLOGY·Filed 2020·Granted Dec 27, 2022·0 cites·8 claims
- 1239US2019198413A1Semiconductor package and manufacturing method thereofKOREA ELECTRONICS TECHNOLOGY·Filed 2018·Application pending·0 cites
- 1339US2020091028A1Semiconductor package using high power and high frequency and method of manufacturing sameKOREA ELECTRONICS TECHNOLOGY·Filed 2018·Application pending·0 cites
- 1433US2016181242A1Passive device and manufacturing method thereofKOREA ELECTRONICS TECHNOLOGY·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →