Inventor · disambiguated record
Teck Beng Lau
Also filed as: LAU TECK BENG
6 granted patents·1 pending application·24 citations·filing 2010–2014
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0183US9190352B2Multi-die sensor deviceTIU KONG BEE·Filed 2013·Granted Nov 17, 2015·8 cites·10 claims
- 0278US8778704B1Solar powered IC chipLAU TECK BENG·Filed 2013·Granted Jul 15, 2014·6 cites·19 claims
- 0372US8809078B1Solar powered IC chipLAU TECK BENG·Filed 2013·Granted Aug 19, 2014·4 cites·17 claims
- 0471US9040335B2Side vented pressure sensor deviceBOON YEW LOW·Filed 2013·Granted May 26, 2015·6 cites·14 claims
- 0543US9287236B2Flexible packaged integrated circuitLAU TECK BENG·Filed 2014·Granted Mar 15, 2016·0 cites·18 claims
- 0640US2015118802A1Dual corner top gate moldingLOW BOON YEW·Filed 2014·Application pending·0 cites
- 0739US8338828B2Semiconductor package and method of testing sameLOW BOON YEW·Filed 2010·Granted Dec 25, 2012·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →