Inventor · disambiguated record
Yu Hwan Kim
Also filed as: KIM YU HWAN
7 granted patents·3 pending applications·24 citations·filing 2010–2021
81Inventor score
Top patents by PatentIndex Score
10 records- 0181US11042855B2Electronic device and remittance method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 22, 2021·4 cites·17 claims
- 0279US8680688B2Stack package having flexible conductorsKANG TAE MIN·Filed 2012·Granted Mar 25, 2014·5 cites·20 claims
- 0378US8288873B2Stack package having flexible conductorsKANG TAE MIN·Filed 2010·Granted Oct 16, 2012·5 cites·16 claims
- 0477US9748118B2Substrate treating apparatusSEMES CO LTD·Filed 2014·Granted Aug 29, 2017·5 cites·15 claims
- 0572US10357806B2Substrate treating apparatus and methodSEMES CO LTD·Filed 2015·Granted Jul 23, 2019·2 cites·12 claims
- 0666US8810309B2Stack package and method for selecting chip in stack packageLEE DAE WOONG·Filed 2011·Granted Aug 19, 2014·3 cites·5 claims
- 0762US2023248031A1Composition for producing protein noodles with improved mouthfeel, method for producing protein noodles using same, and protein noodles produced by using sameDAESANG CORP·Filed 2021·Application pending·0 cites
- 0850US2019172051A1Electronic device and method for processing remote paymentSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 0936US8164200B2Stack semiconductor package and method for manufacturing the sameKANG TAE MIN·Filed 2010·Granted Apr 24, 2012·0 cites·11 claims
- 1036US2013284209A1Apparatus and method for cleaning substratesSEMES CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →