Inventor · disambiguated record
Brian E. Stine
Also filed as: STINE BRIAN · STINE BRIAN E
22 granted patents·1,206 citations·filing 1999–2020
96Inventor score
Files withPDF SOLUTIONS INC22
Top patents by PatentIndex Score
22 records- 0198US6834375B1System and method for product yield prediction using a logic characterization vehiclePDF SOLUTIONS INC·Filed 2000·Granted Dec 21, 2004·246 cites·11 claims
- 0297US6901564B2System and method for product yield predictionPDF SOLUTIONS INC·Filed 2002·Granted May 31, 2005·143 cites·45 claims
- 0397US6795952B1System and method for product yield prediction using device and process neighborhood characterization vehiclePDF SOLUTIONS INC·Filed 2002·Granted Sep 21, 2004·264 cites·20 claims
- 0496US6449749B1System and method for product yield predictionPDF SOLUTIONS INC·Filed 1999·Granted Sep 10, 2002·202 cites·16 claims
- 0595US7174521B2System and method for product yield predictionPDF SOLUTIONS INC·Filed 2005·Granted Feb 6, 2007·32 cites·36 claims
- 0693US7487474B2Designing an integrated circuit to improve yield using a variant design elementPDF SOLUTIONS INC·Filed 2003·Granted Feb 3, 2009·182 cites·64 claims
- 0792US7356800B2System and method for product yield predictionPDF SOLUTIONS INC·Filed 2006·Granted Apr 8, 2008·15 cites·20 claims
- 0891US7673262B2System and method for product yield predictionPDF SOLUTIONS INC·Filed 2008·Granted Mar 2, 2010·11 cites·20 claims
- 0991US7373625B2System and method for product yield predictionPDF SOLUTIONS INC·Filed 2006·Granted May 13, 2008·12 cites·29 claims
- 1084US6475871B1Passive multiplexor test structure for integrated circuit manufacturingPDF SOLUTIONS INC·Filed 2000·Granted Nov 5, 2002·32 cites·23 claims
- 1179US7494893B1Identifying yield-relevant process parameters in integrated circuit device fabrication processesPDF SOLUTIONS INC·Filed 2007·Granted Feb 24, 2009·14 cites·20 claims
- 1274US7024642B2Extraction method of defect density and size distributionsPDF SOLUTIONS INC·Filed 2002·Granted Apr 4, 2006·16 cites·24 claims
- 1371US10268562B1Advanced manufacturing insight system for semiconductor applicationPDF SOLUTIONS INC·Filed 2017·Granted Apr 23, 2019·2 cites·12 claims
- 1466US7197726B2Test structures for estimating dishing and erosion effects in copper damascene technologyPDF SOLUTIONS INC·Filed 2002·Granted Mar 27, 2007·11 cites·22 claims
- 1565US7348594B2Test structures and models for estimating the yield impact of dishing and/or voidsPDF SOLUTIONS INC·Filed 2002·Granted Mar 25, 2008·12 cites·15 claims
- 1664US7807480B2Test cells for semiconductor yield improvementPDF SOLUTIONS INC·Filed 2007·Granted Oct 5, 2010·4 cites·13 claims
- 1760US7305638B1Method and system for ROM coding to improve yieldPDF SOLUTIONS INC·Filed 2005·Granted Dec 4, 2007·4 cites·24 claims
- 1859US10897814B2Characterization vehicles for printed circuit board and system designPDF SOLUTIONS INC·Filed 2019·Granted Jan 19, 2021·0 cites·19 claims
- 1956US10517169B2Characterization vehicles for printed circuit board and system designPDF SOLUTIONS INC·Filed 2018·Granted Dec 24, 2019·0 cites·19 claims
- 2054US7154115B2Zoom in pin nest structure, test vehicle having the structure, and method of fabricating the structurePDF SOLUTIONS INC·Filed 2003·Granted Dec 26, 2006·4 cites·28 claims
- 2146US12038802B2Collaborative learning model for semiconductor applicationsPDF SOLUTIONS INC·Filed 2020·Granted Jul 16, 2024·0 cites·13 claims
- 2239US10656204B2Failure detection for wire bonding in semiconductorsPDF SOLUTIONS INC·Filed 2018·Granted May 19, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →