Inventor · disambiguated record
Hiroyuki Ichizoe
Also filed as: ICHIZOE HIROYUKI
7 granted patents·2 pending applications·89 citations·filing 1999–2007
86Inventor score
Files withHITACHI LTD2RENESAS TECH CORP2ELPIDA MEMORY INC1HITACHI ULSI SYS CO LTD1HITACHI ULSI SYSTEMS C O LTD1
Top patents by PatentIndex Score
9 records- 0193US7208391B2Method of manufacturing a semiconductor integrated circuit device that includes forming an isolation trench around active regions and filling the trench with two insulating filmsRENESAS TECH CORP·Filed 2005·Granted Apr 24, 2007·19 cites·15 claims
- 0291US7074691B2Method of manufacturing a semiconductor integrated circuit device that includes forming dummy patterns in an isolation region prior to filling with insulating materialHITACHI ULSI SYSTEMS C O LTD·Filed 2005·Granted Jul 11, 2006·20 cites·12 claims
- 0387US6693008B1Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2000·Granted Feb 17, 2004·29 cites·9 claims
- 0478US7060589B2Method for manufacturing a semiconductor integrated circuit device that includes covering the bottom of an isolation trench with spin-on glass and etching back the spin-on glass to a predetermined depthHITACHI ULSI SYS CO LTD·Filed 2005·Granted Jun 13, 2006·4 cites·13 claims
- 0555US6720234B2Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processingHITACHI LTD·Filed 2003·Granted Apr 13, 2004·5 cites·28 claims
- 0650US6562695B1Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processingHITACHI LTD·Filed 1999·Granted May 13, 2003·12 cites·35 claims
- 0743US2004106292A1Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit deviceFiled 2003·Application pending·0 cites
- 0842US7397104B2Semiconductor integrated circuit device and a method of manufacturing the sameELPIDA MEMORY INC·Filed 2004·Granted Jul 8, 2008·0 cites·13 claims
- 0942US2007114631A1Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit deviceSATO HIDENORI·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hiroyuki Ichizoe files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →