Inventor · disambiguated record
Wilbur C. Krusell
Also filed as: KRUSELL WILBUR · KRUSELL WILBUR C
35 granted patents·1 pending application·1,894 citations·filing 1992–2003
98Inventor score
Top patents by PatentIndex Score
36 records- 0196US6488040B1Capillary proximity heads for single wafer cleaning and dryingLAM RES CORP·Filed 2000·Granted Dec 3, 2002·178 cites·29 claims
- 0295US6616772B2Methods for wafer proximity cleaning and dryingLAM RES CORP·Filed 2002·Granted Sep 9, 2003·110 cites·16 claims
- 0395US6594847B1Single wafer residue, thin film removal and cleanLAM RES CORP·Filed 2000·Granted Jul 22, 2003·112 cites·18 claims
- 0495US6428394B1Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feedLAM RES CORP·Filed 2000·Granted Aug 6, 2002·65 cites·19 claims
- 0593US6111634AMethod and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishingLAM RES CORP·Filed 1997·Granted Aug 29, 2000·155 cites·21 claims
- 0691US6621584B2Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishingLAM RES CORP·Filed 2000·Granted Sep 16, 2003·36 cites·22 claims
- 0791US6146248AMethod and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisherLAM RES CORP·Filed 1997·Granted Nov 14, 2000·114 cites·37 claims
- 0891US6108091AMethod and apparatus for in-situ monitoring of thickness during chemical-mechanical polishingLAM RES CORP·Filed 1997·Granted Aug 22, 2000·86 cites·27 claims
- 0988US6261155B1Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisherLAM RES CORP·Filed 2000·Granted Jul 17, 2001·42 cites·20 claims
- 1088US5861066AMethod and apparatus for cleaning edges of contaminated substratesONTRAK SYSTEMS INC·Filed 1996·Granted Jan 19, 1999·88 cites·18 claims
- 1184US6334229B1Apparatus for cleaning edges of contaminated substratesLAM RES CORP·Filed 1999·Granted Jan 1, 2002·63 cites·31 claims
- 1284US6328642B1Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 1997·Granted Dec 11, 2001·66 cites·19 claims
- 1384US6162301AMethods and apparatus for cleaning semiconductor substrates after polishing of copper filmLAM RES CORP·Filed 1999·Granted Dec 19, 2000·56 cites·15 claims
- 1483US5304398AChemical vapor deposition of silicon dioxide using hexamethyldisilazaneWATKINS JOHNSON CO·Filed 1993·Granted Apr 19, 1994·67 cites·5 claims
- 1582US6500056B1Linear reciprocating disposable belt polishing method and apparatusLAM RES CORP·Filed 2000·Granted Dec 31, 2002·22 cites·8 claims
- 1680US6165956AMethods and apparatus for cleaning semiconductor substrates after polishing of copper filmLAM RES CORP·Filed 1997·Granted Dec 26, 2000·46 cites·1 claims
- 1779US6517418B2Method of transporting a semiconductor wafer in a wafer polishing systemLAM RES CORP·Filed 2001·Granted Feb 11, 2003·18 cites·15 claims
- 1879US6336845B1Method and apparatus for polishing semiconductor wafersLAM RES CORP·Filed 1997·Granted Jan 8, 2002·45 cites·25 claims
- 1979US6325706B1Use of zeta potential during chemical mechanical polishing for end point detectionLAM RES CORP·Filed 1998·Granted Dec 4, 2001·54 cites·23 claims
- 2079US6274059B1Method to remove metals in a scrubberLAM RES CORP·Filed 1996·Granted Aug 14, 2001·55 cites·19 claims
- 2179US5762755AOrganic preclean for improving vapor phase wafer etch uniformityGENUS INC·Filed 1992·Granted Jun 9, 1998·72 cites·7 claims
- 2278US6224461B1Method and apparatus for stabilizing the process temperature during chemical mechanical polishingLAM RES CORP·Filed 1999·Granted May 1, 2001·44 cites·22 claims
- 2376US6746320B2Linear reciprocating disposable belt polishing method and apparatusLAM RES CORP·Filed 2002·Granted Jun 8, 2004·15 cites·6 claims
- 2476US5868863AMethod and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF)ONTRAK SYSTEMS INC·Filed 1997·Granted Feb 9, 1999·34 cites·13 claims
- 2575US6186865B1Apparatus and method for performing end point detection on a linear planarization toolLAM RES CORP·Filed 1998·Granted Feb 13, 2001·38 cites·30 claims
- 2675US5762084AMegasonic bathONTRAK SYSTEMS INC·Filed 1996·Granted Jun 9, 1998·46 cites·25 claims
- 2772US6479443B1Cleaning solution and method for cleaning semiconductor substrates after polishing of copper filmLAM RES CORP·Filed 2000·Granted Nov 12, 2002·15 cites·5 claims
- 2870US5693148AProcess for brush cleaningONTRAK SYSTEMS INC·Filed 1995·Granted Dec 2, 1997·38 cites·52 claims
- 2969US6927198B2Methods and apparatus for cleaning semiconductor substrates after polishing of copper filmLAM RES CORP·Filed 2003·Granted Aug 9, 2005·9 cites·26 claims
- 3068US5723019ADrip chemical delivery method and apparatusONTRAK SYSTEMS INC·Filed 1996·Granted Mar 3, 1998·32 cites·20 claims
- 3161US5853522ADrip chemical delivery apparatusONTRAK SYSTEMS INC·Filed 1996·Granted Dec 29, 1998·22 cites·22 claims
- 3258US5840129AHesitation free rollerONTRAK SYSTEMS INC·Filed 1996·Granted Nov 24, 1998·22 cites·7 claims
- 3357US6656025B2Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 2001·Granted Dec 2, 2003·5 cites·13 claims
- 3450US6003185AHesitation free rollerONTRAK SYSTEMS INC·Filed 1996·Granted Dec 21, 1999·16 cites·38 claims
- 3546US6145148AMethod and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF)LAM RES CORP·Filed 1999·Granted Nov 14, 2000·8 cites·13 claims
- 3640US2005118936A1Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wilbur C. Krusell files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →