Inventor · disambiguated record
Ryou Nakamura
Also filed as: NAKAMURA RYOU
8 granted patents·5 pending applications·29 citations·filing 2003–2022
80Inventor score
Top patents by PatentIndex Score
13 records- 0170US7166516B2Method for fabricating a semiconductor device including the use of a compound containing silicon and nitrogen to form an insulation film of SiN or SiCNFUJITSU LTD·Filed 2003·Granted Jan 23, 2007·13 cites·15 claims
- 0268US7294577B2Method of manufacturing a silicide layerFUJITSU LTD·Filed 2005·Granted Nov 13, 2007·3 cites·19 claims
- 0363US7037803B2Manufacture of semiconductor device having STI and semiconductor device manufacturedFUJITSU LTD·Filed 2003·Granted May 2, 2006·12 cites·33 claims
- 0462US12455548B2Numerical control device, and numerical control systemFANUC CORP·Filed 2021·Granted Oct 28, 2025·0 cites·11 claims
- 0562US12372945B2Numerical control systemFANUC CORP·Filed 2021·Granted Jul 29, 2025·0 cites·4 claims
- 0661US7859088B2Semiconductor device manufacturing method, wafer, and wafer manufacturing methodFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Dec 28, 2010·1 cites·4 claims
- 0752US9371122B2Vessel propulsion apparatusYAMAHA MOTOR CO LTD·Filed 2014·Granted Jun 21, 2016·0 cites·10 claims
- 0851US2025004445A1Numerical control systemFANUC CORP·Filed 2021·Application pending·0 cites
- 0951US2024066690A1Numerical control apparatus and numerical control systemFANUC CORP·Filed 2022·Application pending·0 cites
- 1048US2023249337A1Numerical control systemFANUC CORP·Filed 2021·Application pending·0 cites
- 1147US7345003B2Semiconductor device manufacturing method, wafer, and wafer manufacturing methodFUJITSU LTD·Filed 2005·Granted Mar 18, 2008·0 cites·16 claims
- 1245US2007072381A1Method for fabricating a semiconductor device including the use of a compound containing silicon and nitrogen to form an insulation film of SiN, SiCN or SiOCNFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1340US2006079087A1Method of producing semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →