Inventor · disambiguated record
Yikang Deng
Also filed as: DENG YIKANG
43 granted patents·13 pending applications·70 citations·filing 2010–2023
96Inventor score
Files withINTEL CORP46APPLE INC3SHENZHEN XINGRISHENG IND CO2TAHOE RES LTD2ALUR AMRUTHAVALLI PALLAVI1
Top patents by PatentIndex Score
56 records- 0196US11696407B2Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrateINTEL CORP·Filed 2021·Granted Jul 4, 2023·3 cites·21 claims
- 0296US10163557B2Helical plated through-hole package inductorINTEL CORP·Filed 2015·Granted Dec 25, 2018·6 cites·9 claims
- 0392USD977208SLitter boxSHENZHEN XINGRISHENG IND CO·Filed 2021·Granted Jan 31, 2023·15 cites·1 claims
- 0491US11521914B2Microelectronic assemblies having a cooling channelINTEL CORP·Filed 2018·Granted Dec 6, 2022·8 cites·13 claims
- 0591US11387224B2Phase change material in substrate cavityINTEL CORP·Filed 2018·Granted Jul 12, 2022·7 cites·20 claims
- 0690US11862597B2Asymmetric stackup structure for SoC package substratesAPPLE INC·Filed 2021·Granted Jan 2, 2024·2 cites·20 claims
- 0790US11646254B2Electronic device including a lateral traceTAHOE RES LTD·Filed 2020·Granted May 9, 2023·2 cites·25 claims
- 0890US10804188B2Electronic device including a lateral traceINTEL CORP·Filed 2018·Granted Oct 13, 2020·5 cites·9 claims
- 0989US10998120B2Method of making an inductorINTEL CORP·Filed 2018·Granted May 4, 2021·1 cites·14 claims
- 1084US10845552B2Coreless package architecture for multi-chip opto-electronicsINTEL CORP·Filed 2017·Granted Nov 24, 2020·4 cites·25 claims
- 1184US9953959B1Metal protected fan-out cavityINTEL CORP·Filed 2017·Granted Apr 24, 2018·4 cites·8 claims
- 1278US11608564B2Helical plated through-hole package inductorINTEL CORP·Filed 2021·Granted Mar 21, 2023·0 cites·13 claims
- 1377US11328968B2Stacked die cavity packageINTEL CORP·Filed 2016·Granted May 10, 2022·2 cites·18 claims
- 1477US9087696B2Systems and methods for non-periodic pulse partial melt film processingIM JAMES S·Filed 2010·Granted Jul 21, 2015·5 cites·27 claims
- 1573US12322721B2Asymmetric Stackup Structure for SoC package substratesAPPLE INC·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 1673US11955426B2Package-integrated multi-turn coil embedded in a package magnetic coreINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·15 claims
- 1773US2023352385A1Electronic device including a lateral traceTAHOE RES LTD·Filed 2023·Application pending·0 cites
- 1872US11705377B2Stacked die cavity packageINTEL CORP·Filed 2022·Granted Jul 18, 2023·0 cites·7 claims
- 1971US11393751B2Package-integrated multi-turn coil embedded in a package magnetic coreINTEL CORP·Filed 2018·Granted Jul 19, 2022·1 cites·15 claims
- 2070US12288744B2Microelectronic assemblies having conductive structures with different thicknesses on a core substrateINTEL CORP·Filed 2022·Granted Apr 29, 2025·0 cites·11 claims
- 2170US10790159B2Semiconductor package substrate with through-hole magnetic core inductor using conductive pasteINTEL CORP·Filed 2018·Granted Sep 29, 2020·1 cites·15 claims
- 2270US10777514B2Techniques for an inductor at a second level interfaceINTEL CORP·Filed 2018·Granted Sep 15, 2020·1 cites·16 claims
- 2368US2023187205A1Substrate package with glass dielectricINTEL CORP·Filed 2023·Application pending·0 cites
- 2468US2023369192A1Dual trace thickness for single layer routingINTEL CORP·Filed 2023·Application pending·0 cites
- 2567US11495555B2Magnetic bilayer structure for a cored or coreless semiconductor packageINTEL CORP·Filed 2018·Granted Nov 8, 2022·1 cites·13 claims
- 2667US10396046B2Substrate assembly with magnetic featureINTEL CORP·Filed 2017·Granted Aug 27, 2019·1 cites·14 claims
- 2766US11031360B2Techniques for an inductor at a second level interfaceINTEL CORP·Filed 2020·Granted Jun 8, 2021·0 cites·13 claims
- 2864US9721880B2Integrated circuit package structuresINTEL CORP·Filed 2015·Granted Aug 1, 2017·1 cites·22 claims
- 2964US2022230800A1Techniques for an inductor at a first level interfaceINTEL CORP·Filed 2022·Application pending·0 cites
- 3062US2022183157A1Apparatus with embedded fine line space in a cavity, and a method for forming the sameINTEL CORP·Filed 2022·Application pending·0 cites
- 3160US11651885B2Magnetic core inductorsINTEL CORP·Filed 2017·Granted May 16, 2023·0 cites·11 claims
- 3259US2015289372A1Fluorescent conductive fill material for plated through hole structures and methods of defect inspection utilizing the sameDENG YIKANG·Filed 2014·Application pending·0 cites
- 3356US11830809B2Magnetic structures in integrated circuit package supportsINTEL CORP·Filed 2020·Granted Nov 28, 2023·0 cites·19 claims
- 3456US11322290B2Techniques for an inductor at a first level interfaceINTEL CORP·Filed 2018·Granted May 3, 2022·0 cites·6 claims
- 3556US11246218B2Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrateINTEL CORP·Filed 2018·Granted Feb 8, 2022·0 cites·22 claims
- 3656US10123431B2Methods of defect inspection of plated through hole structures utilizing fluorescent conductive fill materialINTEL CORP·Filed 2016·Granted Nov 6, 2018·0 cites·15 claims
- 3755US11380609B2Microelectronic assemblies having conductive structures with different thicknesses on a core substrateINTEL CORP·Filed 2018·Granted Jul 5, 2022·0 cites·20 claims
- 3854US12356955B2Pet excrement collecting device capable of closing excrement collecting bagSHENZHEN XINGRISHENG IND CO·Filed 2021·Granted Jul 15, 2025·0 cites·16 claims
- 3954US10361165B2Microelectronic substrate having embedded trace layers with integral attachment structuresINTEL CORP·Filed 2017·Granted Jul 23, 2019·0 cites·14 claims
- 4054US2025046689A1Routing Substrates with Cavities for Component StackingAPPLE INC·Filed 2023·Application pending·0 cites
- 4153US11769719B2Dual trace thickness for single layer routingINTEL CORP·Filed 2018·Granted Sep 26, 2023·0 cites·8 claims
- 4251US11923307B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Mar 5, 2024·0 cites·18 claims
- 4351US11444042B2Magnetic structures in integrated circuit packagesINTEL CORP·Filed 2018·Granted Sep 13, 2022·0 cites·18 claims
- 4451US2020027728A1Substrate package with glass dielectricINTEL CORP·Filed 2018·Application pending·0 cites
- 4550US11272619B2Apparatus with embedded fine line space in a cavity, and a method for forming the sameINTEL CORP·Filed 2016·Granted Mar 8, 2022·0 cites·11 claims
- 4650US9653419B2Microelectronic substrate having embedded trace layers with integral attachment structuresINTEL CORP·Filed 2015·Granted May 16, 2017·0 cites·32 claims
- 4749US11404364B2Multi-layer embedded magnetic inductor coilINTEL CORP·Filed 2018·Granted Aug 2, 2022·0 cites·12 claims
- 4846US12336197B2In-plane inductors in IC packagesINTEL CORP·Filed 2020·Granted Jun 17, 2025·0 cites·19 claims
- 4944US11502017B2Effective heat conduction from hotspot to heat spreader through package substrateINTEL CORP·Filed 2018·Granted Nov 15, 2022·0 cites·21 claims
- 5044US2020119250A1In-situ formation of a thermoelectric device in a substrate packagingINTEL CORP·Filed 2018·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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