Inventor · disambiguated record
Chihwei Lee
Also filed as: LEE CHIHWEI
5 granted patents·7 citations·filing 2019–2023
65Inventor score
Top patents by PatentIndex Score
5 records- 0194US11013149B2Electronic device including heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 18, 2021·7 cites·19 claims
- 0252US11464107B2Board including multiple conductive pads corresponding to one contact, and electronic device for identifying conductive padsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 4, 2022·0 cites·20 claims
- 0351US11183748B2Electronic device including antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 23, 2021·0 cites·17 claims
- 0444US12464638B2Vibration dampening for high-density storage system structureHYVE SOLUTIONS CORP·Filed 2023·Granted Nov 4, 2025·0 cites·18 claims
- 0540US12248343B2High-density storage system structureHYVE SOLUTIONS CORP·Filed 2023·Granted Mar 11, 2025·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →