Inventor · disambiguated record
Jia-Cheng Hsu
Also filed as: HSU JIA-CHENG
2 granted patents·2 pending applications·20 citations·filing 2004–2014
59Inventor score
Top patents by PatentIndex Score
4 records- 0187US9409276B2CMP polishing pad having edge exclusion region of offset concentric groove patternCABOT MICROELECTRONICS CORP·Filed 2014·Granted Aug 9, 2016·11 cites·7 claims
- 0281US9687956B2Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewithCABOT MICROELECTRONICS CORP·Filed 2013·Granted Jun 27, 2017·9 cites·19 claims
- 0342US2005203286A1Environmental protection series of reactive dyestuffs and their useEVERLIGHT USA INC·Filed 2004·Application pending·0 cites
- 0432US2011014858A1Grooved cmp polishing padCABOT MICROELECTRONICS CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →