Inventor · disambiguated record
Ching-Ming Tsai
Also filed as: TSAI CHING-MING
5 granted patents·3 pending applications·55 citations·filing 2003–2014
79Inventor score
Top patents by PatentIndex Score
8 records- 0187US9409276B2CMP polishing pad having edge exclusion region of offset concentric groove patternCABOT MICROELECTRONICS CORP·Filed 2014·Granted Aug 9, 2016·11 cites·7 claims
- 0281US9687956B2Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewithCABOT MICROELECTRONICS CORP·Filed 2013·Granted Jun 27, 2017·9 cites·19 claims
- 0375US6830504B1Barrier-slurry-free copper CMP processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Dec 14, 2004·17 cites·65 claims
- 0469US6756309B1Feed forward process control method for adjusting metal line RsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 29, 2004·18 cites·19 claims
- 0549USRE45468EBarrier-slurry-free copper CMP processCHEN YI-CHEN·Filed 2006·Granted Apr 14, 2015·0 cites·70 claims
- 0639US2005112895A1Method of chemical-mechanical polishingFiled 2004·Application pending·0 cites
- 0737US2005059233A1Process for forming metal damascene structure to prevent dielectric layer peelingFiled 2003·Application pending·0 cites
- 0832US2011014858A1Grooved cmp polishing padCABOT MICROELECTRONICS CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →