Inventor · disambiguated record
Xinchun Lu
Also filed as: LU XINCHUN
7 granted patents·4 pending applications·12 citations·filing 2011–2024
75Inventor score
Top patents by PatentIndex Score
11 records- 0178US9138857B2Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the sameLU XINCHUN·Filed 2011·Granted Sep 22, 2015·8 cites·14 claims
- 0275US12109664B1Method for determining thickness of metal film of wafer, polishing device, and mediumHWATSING BEIJING TECH CO LTD·Filed 2024·Granted Oct 8, 2024·1 cites·15 claims
- 0375US10857646B2Apparatus for chemical-mechanical polishingUNIV TSINGHUA·Filed 2017·Granted Dec 8, 2020·1 cites·10 claims
- 0462US12151335B1Monitoring method for chemical mechanical polishing and chemical mechanical polishing deviceHWATSING TECH CO LTD·Filed 2024·Granted Nov 26, 2024·0 cites·16 claims
- 0556US8912790B2Measuring device for measuring film thickness of silicon waferLU XINCHUN·Filed 2011·Granted Dec 16, 2014·2 cites·17 claims
- 0638US9255780B2Method for measuring thickness of film on wafer edgeLU XINCHUN·Filed 2011·Granted Feb 9, 2016·0 cites·12 claims
- 0737US9377286B2Device for globally measuring thickness of metal filmLU XINCHUN·Filed 2011·Granted Jun 28, 2016·0 cites·5 claims
- 0834US2012115403A1Pad conditioner head for conditioning a polishing padLU XINCHUN·Filed 2011·Application pending·0 cites
- 0934US2012315826A1Device and Method for Measuring Physical Parameters of Slurry and Chemical Mechanical Polishing Apparatus Comprising the DeviceLU XINCHUN·Filed 2011·Application pending·0 cites
- 1032US2013000845A1Device and Method for Measuring Thickness of Slurry and Chemical Mechanical Polishing Apparatus Comprising the DeviceUNIV TSINGHUA·Filed 2011·Application pending·0 cites
- 1128US2013273819A1Wafer transfer device for chemical mechanical polishing apparatusLU XINCHUN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →