Inventor · disambiguated record
Seiichi Ichihara
Also filed as: ICHIHARA SEIICHI
12 granted patents·7 pending applications·289 citations·filing 1989–2015
91Inventor score
Files withHITACHI LTD5RENESAS ELECTRONICS CORP3RENESAS TECH CORP2HASHIMURA TADAYOSHI1HITACHI ULSI SYS CO LTD1
Top patents by PatentIndex Score
19 records- 0194US5061985ASemiconductor integrated circuit device and process for producing the sameHITACHI LTD·Filed 1989·Granted Oct 29, 1991·164 cites·24 claims
- 0290US6476467B2Semiconductor device and process for producing the sameHITACHI LTD·Filed 2001·Granted Nov 5, 2002·56 cites·9 claims
- 0379US6278176B1Semiconductor device and process for producing the sameHITACHI LTD·Filed 2000·Granted Aug 21, 2001·24 cites·11 claims
- 0477US8708079B2Vehicle body structureHASHIMURA TADAYOSHI·Filed 2010·Granted Apr 29, 2014·7 cites·13 claims
- 0574US9224622B2Semiconductor device, method of manufacturing the device, and liquid crystal displayRENESAS ELECTRONICS CORP·Filed 2012·Granted Dec 29, 2015·3 cites·3 claims
- 0662US6060770ASemiconductor device and process for producing the sameHITACHI LTD·Filed 1998·Granted May 9, 2000·23 cites·5 claims
- 0759US6699737B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Mar 2, 2004·8 cites·13 claims
- 0849US7470568B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Dec 30, 2008·0 cites·7 claims
- 0948US8587135B2Semiconductor device having electrode/film opening edge spacing smaller than bonding pad/electrode edge spacingRENESAS ELECTRONICS CORP·Filed 2012·Granted Nov 19, 2013·0 cites·19 claims
- 1047US2016071769A1Semiconductor device, method of manufacturing the device, and liquid crystal displayRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1146US6645794B2Method of manufacturing a semiconductor device by monolithically forming a sealing resin for sealing a chip and a reinforcing frame by transfer moldingHITACHI LTD·Filed 2002·Granted Nov 11, 2003·2 cites·3 claims
- 1245US7262083B2Method of manufacturing a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2004·Granted Aug 28, 2007·2 cites·9 claims
- 1345US2005167808A1Semiconductor device, its fabrication method and electronic deviceFiled 2005·Application pending·0 cites
- 1439US8338288B2Method of manufacturing semiconductor deviceWADA TAMAKI·Filed 2011·Granted Dec 25, 2012·0 cites·26 claims
- 1539US2003017652A1Semiconductor device, its fabrication method and electronic deviceFiled 2002·Application pending·0 cites
- 1637US2008090314A1Semiconductor device and manufacturing method of the sameICHIHARA SEIICHI·Filed 2007·Application pending·0 cites
- 1733US2001008779A1Semiconductor device and manufacturing methodFiled 2001·Application pending·0 cites
- 1833US2001006251A1Semiconductor device and manufacturing methodFiled 2000·Application pending·0 cites
- 1930US2002149027A1Semiconductor device and its manufacture, and semiconductor device packaging structureFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →