Inventor · disambiguated record
Erxuan Ping
Also filed as: Ping Erxuan
10 granted patents·6 citations·filing 2020–2022
79Inventor score
Files withCHANGXIN MEMORY TECH INC10
Top patents by PatentIndex Score
10 records- 0191US12108591B2Semiconductor structure, method for forming semiconductor structure and memoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 1, 2024·2 cites·18 claims
- 0291US12082419B2Semiconductor structure and forming method therefor, and memory and forming method thereforCHANGXIN MEMORY TECH INC·Filed 2021·Granted Sep 3, 2024·2 cites·9 claims
- 0390US11895852B2Method for forming semiconductor structure by using sacrificial layer configured to be replaced subsequently to form bit line, semiconductor structure, and memoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Feb 6, 2024·2 cites·12 claims
- 0458US12419041B2Method for forming storage node contact structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Sep 16, 2025·0 cites·16 claims
- 0555US12340870B2Method for forming a semiconductor device pillar with source, channel, and drainCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jun 24, 2025·0 cites·18 claims
- 0652US11887859B2Method for forming active region array and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 30, 2024·0 cites·18 claims
- 0752US11871562B2Method for forming storage node contact structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 9, 2024·0 cites·16 claims
- 0852US11805701B2Memory and forming methods and control methods thereofCHANGXIN MEMORY TECH INC·Filed 2020·Granted Oct 31, 2023·0 cites·20 claims
- 0951US12376291B2Semiconductor device including shared sense amplification circuit groupCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jul 29, 2025·0 cites·10 claims
- 1039US11875835B2Memory and read and write methods of memoryCHANGXIN MEMORY TECH INC·Filed 2020·Granted Jan 16, 2024·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →