Inventor · disambiguated record
Zhicheng Ding
Also filed as: DING ZHICHENG
17 granted patents·3 pending applications·25 citations·filing 2015–2022
89Inventor score
Top patents by PatentIndex Score
20 records- 0194US10910347B2Method, apparatus and system to interconnect packaged integrated circuit diesINTEL CORP·Filed 2019·Granted Feb 2, 2021·10 cites·22 claims
- 0290US10991679B2Stair-stacked dice device in a system in package, and methods of making sameINTEL CORP·Filed 2020·Granted Apr 27, 2021·2 cites·20 claims
- 0389US10930622B2Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making sameINTEL CORP·Filed 2020·Granted Feb 23, 2021·2 cites·21 claims
- 0478US11538746B2Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making sameINTEL CORP·Filed 2016·Granted Dec 27, 2022·3 cites·17 claims
- 0578US10770434B2Stair-stacked dice device in a system in package, and methods of making sameINTEL CORP·Filed 2016·Granted Sep 8, 2020·2 cites·21 claims
- 0678US10727208B2Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making sameINTEL CORP·Filed 2016·Granted Jul 28, 2020·2 cites·25 claims
- 0776US11081451B2Die stack with reduced warpageINTEL CORP·Filed 2017·Granted Aug 3, 2021·2 cites·23 claims
- 0875US10396055B2Method, apparatus and system to interconnect packaged integrated circuit diesINTEL CORP·Filed 2015·Granted Aug 27, 2019·2 cites·24 claims
- 0972US11894344B2Power enhanced stacked chip scale package solution with integrated die attach filmINTEL CORP·Filed 2022·Granted Feb 6, 2024·0 cites·19 claims
- 1067US11848281B2Die stack with reduced warpageINTEL CORP·Filed 2021·Granted Dec 19, 2023·0 cites·18 claims
- 1155US11302671B2Power enhanced stacked chip scale package solution with integrated die attach filmINTEL CORP·Filed 2017·Granted Apr 12, 2022·0 cites·20 claims
- 1252US12027496B2Film in substrate for releasing z stack-up constraintINTEL CORP·Filed 2019·Granted Jul 2, 2024·0 cites·25 claims
- 1348US11990395B2Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancementINTEL CORP·Filed 2019·Granted May 21, 2024·0 cites·25 claims
- 1447US11742284B2Interconnect structure fabricated using lithographic and deposition processesINTEL CORP·Filed 2018·Granted Aug 29, 2023·0 cites·22 claims
- 1541US11830848B2Electronic device packageINTEL CORP·Filed 2016·Granted Nov 28, 2023·0 cites·15 claims
- 1640US11101254B2Flip-chip like integrated passive prepackage for SIP deviceINTEL CORP·Filed 2015·Granted Aug 24, 2021·0 cites·12 claims
- 1736US11148044B2Input device for intelligent terminalSHANGHAI ZHONGLIAN TECH LTD CO·Filed 2018·Granted Oct 19, 2021·0 cites·8 claims
- 1836US2019355700A1Techniques for windowed substrate integrated circuit packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 1935US2019371766A1Integrated circuit die stacksINTEL CORP·Filed 2016·Application pending·0 cites
- 2035US2020310556A1An input device for intelligent terminal, shell and intelligent terminalSHANGHAI ZHONGLIAN TECH LTD CO·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →