Inventor · disambiguated record
Yusuke Hama
Also filed as: HAMA YUSUKE
7 granted patents·4 pending applications·0 citations·filing 2014–2024
68Inventor score
Files withMERCK PATENT GMBH6AZ ELECTRONIC MAT LUXEMBOURG SARL3AZ ELECTRONIC MAT (LUXEMBOURG) S A R L1SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
11 records- 0167US11914296B2Ethynyl derived composite, a composition comprising thereof, a method for manufacturing a coating by it, and a method for manufacturing a device comprising the coatingMERCK PATENT GMBH·Filed 2023·Granted Feb 27, 2024·0 cites·20 claims
- 0255US2025130496A1Positive type lift-off resist composition and method for manufacturing resist pattern using the sameMERCK PATENT GMBH·Filed 2024·Application pending·0 cites
- 0352US9804493B2Composition for forming topcoat layer and resist pattern formation method employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 31, 2017·0 cites·10 claims
- 0451US11609498B2Ethynyl derived composite, a composition comprising thereof, a method for manufacturing a coating by it, and a method for manufacturing a device comprising the coatingMERCK PATENT GMBH·Filed 2018·Granted Mar 21, 2023·0 cites·20 claims
- 0544US11366389B2Allyloxy derivative, resist underlayer forming composition using the same, and method of manufacturing resist underlayer and semiconductor device using the sameMERCK PATENT GMBH·Filed 2018·Granted Jun 21, 2022·0 cites·20 claims
- 0642US10268117B2Top-layer membrane formation composition and method for forming resist pattern using sameAZ ELECTRONIC MAT LUXEMBOURG SARL·Filed 2015·Granted Apr 23, 2019·0 cites·19 claims
- 0741US11450805B2Compound, semiconductor material, and methods for manufacturing coating and semiconductor using the sameMERCK PATENT GMBH·Filed 2017·Granted Sep 20, 2022·0 cites·14 claims
- 0841US10451971B2Composition for forming underlayer and method for forming underlayer therewithAZ ELECTRONIC MAT LUXEMBOURG SARL·Filed 2016·Granted Oct 22, 2019·0 cites·14 claims
- 0937US2021263414A1A photoresist composition, a method for manufacturing a photoresist coating, etched photoresist coating, and etched si containing layer(s), and manufacturing a device using thereofMERCK PATENT GMBH·Filed 2019·Application pending·0 cites
- 1033US2019048129A1A polymer, composition, forming sacrificial layer and method for semiconductor device therewithAZ ELECTRONIC MAT LUXEMBOURG SARL·Filed 2017·Application pending·0 cites
- 1130US2017218227A1Sacrificial film composition, method for preparing same, semiconductor device having voids formed using said composition, and method for manufacturing semiconductor device using said compositionAZ ELECTRONIC MAT (LUXEMBOURG) S A R L·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →