Inventor · disambiguated record
Kyoko Nishidono
Also filed as: NISHIDONO KYOKO
2 granted patents·1 citations·filing 2016–2018
31Inventor score
Technology areasH10W
Files withPANASONIC IP MAN CO LTD2
Top patents by PatentIndex Score
2 records- 0153US9633922B2Sealing epoxy resin composition, hardened product, and semiconductor devicePANASONIC IP MAN CO LTD·Filed 2016·Granted Apr 25, 2017·1 cites·8 claims
- 0243US11244878B2Semiconductor chip-encapsulating resin composition containing epoxy resin, and semiconductor package including a cured product of the semiconductor-chip-encapsulating resin compositionPANASONIC IP MAN CO LTD·Filed 2018·Granted Feb 8, 2022·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →