Inventor · disambiguated record
Kazuto Ogawa
Also filed as: OGAWA KAZUTO
13 granted patents·6 pending applications·75 citations·filing 2002–2023
88Inventor score
Files withTOKYO ELECTRON LTD8MURATA MANUFACTURING CO4PANASONIC IP MAN CO LTD3OHMATA HISAYUKI1OHTAKE GO1
Top patents by PatentIndex Score
19 records- 0196US9396960B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Jul 19, 2016·44 cites·12 claims
- 0278US9449838B2Semiconductor device manufacturing methodTOKYO ELECTRON LTD·Filed 2015·Granted Sep 20, 2016·2 cites·11 claims
- 0376US7297635B2Processing methodTOKYO ELECTRON LTD·Filed 2002·Granted Nov 20, 2007·18 cites·16 claims
- 0474US9839135B2Method of producing electronic components and method of producing substrate-type terminalsMURATA MANUFACTURING CO·Filed 2014·Granted Dec 5, 2017·3 cites·7 claims
- 0567US8039758B2Mounting structure for electronic componentMURATA MANUFACTURING CO·Filed 2007·Granted Oct 18, 2011·4 cites·6 claims
- 0665US9801283B2Method of producing electronic componentsMURATA MANUFACTURING CO·Filed 2014·Granted Oct 24, 2017·1 cites·19 claims
- 0757US9039913B2Semiconductor device manufacturing methodTOKYO ELECTRON LTD·Filed 2014·Granted May 26, 2015·0 cites·8 claims
- 0856US2025250458A1Encapsulation epoxy resin composition and electronic devicePANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 0955US9978515B2Electronic component unit and manufacturing method thereforMURATA MANUFACTURING CO·Filed 2014·Granted May 22, 2018·0 cites·16 claims
- 1053US9633922B2Sealing epoxy resin composition, hardened product, and semiconductor devicePANASONIC IP MAN CO LTD·Filed 2016·Granted Apr 25, 2017·1 cites·8 claims
- 1150US9099285B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Aug 4, 2015·0 cites·5 claims
- 1250US7285498B2Etching methodTOSHIBA KK·Filed 2004·Granted Oct 23, 2007·2 cites·19 claims
- 1350US2007298617A1Processing methodTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 1447US9082720B2Semiconductor device manufacturing methodTOKYO ELECTRON LTD·Filed 2014·Granted Jul 14, 2015·0 cites·5 claims
- 1543US2004025023A1Watermarking application system for broadcast contents copyright protectionFiled 2003·Application pending·0 cites
- 1642US2015287618A1Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
- 1735US9932473B2Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin compositionPANASONIC IP MAN CO LTD·Filed 2016·Granted Apr 3, 2018·0 cites·18 claims
- 1834US2014096154A1Integrated broadcasting communications receiver and resource managing deviceOHTAKE GO·Filed 2012·Application pending·0 cites
- 1927US2014090019A1Integrated broadcasting communications receiver, resource access controlling program, and integrated broadcasting communications systemOHMATA HISAYUKI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →