Inventor · disambiguated record
Erich Berndlmaier
Also filed as: BERNDLMAIER ERICH
4 granted patents·409 citations·filing 1979–1991
82Inventor score
Files withIBM4
Top patents by PatentIndex Score
4 records- 0197US4323914AHeat transfer structure for integrated circuit packageIBM·Filed 1979·Granted Apr 6, 1982·287 cites·3 claims
- 0278US5059553AMetal bump for a thermal compression bond and method for making sameIBM·Filed 1991·Granted Oct 22, 1991·70 cites·5 claims
- 0378US4346343APower control means for eliminating circuit to circuit delay differences and providing a desired circuit delayIBM·Filed 1980·Granted Aug 24, 1982·29 cites·27 claims
- 0451US5053851AMetal bump for a thermal compression bond and method for making sameIBM·Filed 1991·Granted Oct 1, 1991·23 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →