Inventor · disambiguated record
Katsushi Terajima
Also filed as: TERAJIMA KATSUSHI
5 granted patents·53 citations·filing 1992–2016
79Inventor score
Top patents by PatentIndex Score
5 records- 0195US10325841B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 18, 2019·19 cites·15 claims
- 0270US5284899AResin paste for tight sealingSUMITOMO BAKELITE CO·Filed 1992·Granted Feb 8, 1994·18 cites·11 claims
- 0367US7799852B2Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and fillerNEC CORP·Filed 2006·Granted Sep 21, 2010·1 cites·4 claims
- 0438US7098276B1Flame-retardant epoxy resin composition and semiconductor device made using the sameSUMITOMO BAKELITE CO·Filed 1999·Granted Aug 29, 2006·6 cites·6 claims
- 0535US5527992ACavity down mounting seam-welding ceramic package for semiconductor deviceNEC CORP·Filed 1994·Granted Jun 18, 1996·9 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →