Inventor · disambiguated record
Doug B. Ingerly
Also filed as: INGERLY DOUG · INGERLY DOUG B
24 granted patents·5 pending applications·49 citations·filing 2008–2025
93Inventor score
Top patents by PatentIndex Score
29 records- 0196US10872820B2Integrated circuit structuresINTEL CORP·Filed 2017·Granted Dec 22, 2020·22 cites·11 claims
- 0293US11335686B2Transistors with back-side contacts to create three dimensional memory and logicINTEL CORP·Filed 2019·Granted May 17, 2022·8 cites·20 claims
- 0392US12381193B2Integrated circuit assembliesINTEL CORP·Filed 2021·Granted Aug 5, 2025·2 cites·26 claims
- 0491US12170273B2Integrated circuit assemblies with direct chip attach to circuit boardsINTEL CORP·Filed 2021·Granted Dec 17, 2024·2 cites·20 claims
- 0590US11024601B2HyperchipINTEL CORP·Filed 2017·Granted Jun 1, 2021·4 cites·22 claims
- 0688US2025300132A1HyperchipINTEL CORP·Filed 2025·Application pending·0 cites
- 0787US12355002B2HyperchipINTEL CORP·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 0887US11824041B2HyperchipINTEL CORP·Filed 2021·Granted Nov 21, 2023·1 cites·14 claims
- 0985US12074138B2HyperchipINTEL CORP·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 1084US12014996B2Moisture hermetic guard ring for semiconductor on insulator devicesINTEL CORP·Filed 2020·Granted Jun 18, 2024·2 cites·12 claims
- 1183US11387198B2Device, system and method for providing inductor structuresINTEL CORP·Filed 2017·Granted Jul 12, 2022·3 cites·15 claims
- 1282US11984430B2HyperchipINTEL CORP·Filed 2023·Granted May 14, 2024·0 cites·8 claims
- 1381US11901347B2Microelectronic package with three-dimensional (3D) monolithic memory dieINTEL CORP·Filed 2020·Granted Feb 13, 2024·1 cites·19 claims
- 1480US12278229B2Hybrid manufacturing for integrated circuit devices and assembliesINTEL CORP·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 1576US2025201797A1Hybrid manufacturing for integrated circuit devices and assembliesINTEL CORP·Filed 2025·Application pending·0 cites
- 1676US2024194533A1Integrated circuit device structures and double-sided electrical testingINTEL CORP·Filed 2023·Application pending·0 cites
- 1775US2025300152A1Integrated circuit assembliesINTEL CORP·Filed 2025·Application pending·0 cites
- 1874US12406945B2Moisture hermetic guard ring for semiconductor on insulator devicesINTEL CORP·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 1973US11444148B2Recoiled metal thin film for 3D inductor with tunable coreINTEL CORP·Filed 2018·Granted Sep 13, 2022·2 cites·14 claims
- 2072US11830829B2Device, system and method for providing inductor structuresINTEL CORP·Filed 2022·Granted Nov 28, 2023·0 cites·16 claims
- 2172US10886195B2Systems and methods for improved through-silicon-viasINTEL CORP·Filed 2016·Granted Jan 5, 2021·2 cites·23 claims
- 2270US11854894B2Integrated circuit device structures and double-sided electrical testingINTEL CORP·Filed 2020·Granted Dec 26, 2023·0 cites·8 claims
- 2369US11817442B2Hybrid manufacturing for integrated circuit devices and assembliesINTEL CORP·Filed 2020·Granted Nov 14, 2023·0 cites·45 claims
- 2452US12400997B2Hybrid manufacturing with modified via-last processINTEL CORP·Filed 2021·Granted Aug 26, 2025·0 cites·42 claims
- 2551US11756886B2Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structuresINTEL CORP·Filed 2020·Granted Sep 12, 2023·0 cites·26 claims
- 2648US8154121B2Polymer interlayer dielectric and passivation materials for a microelectronic deviceSHAH KUNAL·Filed 2008·Granted Apr 10, 2012·0 cites·20 claims
- 2748US2024363490A1Through-silicon via dieINTEL CORP·Filed 2023·Application pending·0 cites
- 2843US10811354B2Fuse array for integrated circuitINTEL CORP·Filed 2016·Granted Oct 20, 2020·0 cites·14 claims
- 2938US11978727B2Package on active silicon semiconductor packagesINTEL CORP·Filed 2017·Granted May 7, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →