Inventor · disambiguated record
Soenke Habenicht
Also filed as: HABENICHT SOENKE
10 granted patents·1 pending application·16 citations·filing 2005–2018
81Inventor score
Top patents by PatentIndex Score
11 records- 0183US9443791B2Leadless semiconductor package and methodNXP BV·Filed 2015·Granted Sep 13, 2016·7 cites·15 claims
- 0277US9425130B2Package with multiple I/O side-solderable terminalsNXP BV·Filed 2014·Granted Aug 23, 2016·7 cites·13 claims
- 0353US8062974B2Semiconductor device with grounding structureHABENICHT SOENKE·Filed 2006·Granted Nov 22, 2011·2 cites·19 claims
- 0441US9466688B2Semiconductor device with multilayer contact and method of manufacturing the sameNXP BV·Filed 2016·Granted Oct 11, 2016·0 cites·20 claims
- 0541US8809695B2Contact structure for an electronic circuit substrate and electronic circuit comprising said contact structureHABENICHT SOENKE·Filed 2008·Granted Aug 19, 2014·0 cites·8 claims
- 0640US11508844B2Semiconductor deviceNexperia BV·Filed 2016·Granted Nov 22, 2022·0 cites·14 claims
- 0740US10720498B2Semiconductor device structure and method of manufactureNexperia BV·Filed 2018·Granted Jul 21, 2020·0 cites·15 claims
- 0840US10586861B2Semiconductor deviceNexperia BV·Filed 2017·Granted Mar 10, 2020·0 cites·16 claims
- 0940US9331186B2Semiconductor device with multilayer contact and method of manufacturing the sameHABENICHT SOENKE·Filed 2009·Granted May 3, 2016·0 cites·19 claims
- 1033US2008251907A1Electronic Device With Stress Relief ElementKONINKL PHILIPS ELECTRONICS NV·Filed 2005·Application pending·0 cites
- 1129US10972074B2Solid state relayNexperia BV·Filed 2017·Granted Apr 6, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →