Inventor · disambiguated record
John O. Dukovic
Also filed as: DUKOVIC JOHN · DUKOVIC JOHN O · DUKOVIC JOHN OWEN
24 granted patents·10 pending applications·1,842 citations·filing 1992–2022
97Inventor score
Top patents by PatentIndex Score
34 records- 0198US6569299B1Membrane partition system for plating of wafersNOVELLUS SYSTEMS INC·Filed 2000·Granted May 27, 2003·101 cites·14 claims
- 0298US6126798AElectroplating anode including membrane partition system and method of preventing passivation of sameNOVELLUS SYSTEMS INC·Filed 1997·Granted Oct 3, 2000·259 cites·38 claims
- 0397US6193859B1Electric potential shaping apparatus for holding a semiconductor wafer during electroplatingNOVELLUS SYSTEMS INC·Filed 1998·Granted Feb 27, 2001·159 cites·29 claims
- 0497US6159354AElectric potential shaping method for electroplatingNOVELLUS SYSTEMS INC·Filed 1997·Granted Dec 12, 2000·182 cites·12 claims
- 0596US5516412AVertical paddle plating cellIBM·Filed 1995·Granted May 14, 1996·394 cites·21 claims
- 0694US6685814B2Method for enhancing the uniformity of electrodeposition or electroetchingIBM·Filed 2001·Granted Feb 3, 2004·37 cites·5 claims
- 0793US11815816B2Apparatus for post exposure bake of photoresistAPPLIED MATERIALS INC·Filed 2021·Granted Nov 14, 2023·2 cites·20 claims
- 0893US7704352B2High-aspect ratio anode and apparatus for high-speed electroplating on a solar cell substrateAPPLIED MATERIALS INC·Filed 2006·Granted Apr 27, 2010·24 cites·28 claims
- 0993US6261426B1Method and apparatus for enhancing the uniformity of electrodeposition or electroetchingIBM·Filed 1999·Granted Jul 17, 2001·77 cites·12 claims
- 1093US5522975AElectroplating workpiece fixtureIBM·Filed 1995·Granted Jun 4, 1996·144 cites·19 claims
- 1193US5312532AMulti-compartment eletroplating systemIBM·Filed 1993·Granted May 17, 1994·149 cites·21 claims
- 1291US5352350AMethod for controlling chemical species concentrationIBM·Filed 1992·Granted Oct 4, 1994·75 cites·23 claims
- 1389US6471845B1Method of controlling chemical bath composition in a manufacturing environmentIBM·Filed 1999·Granted Oct 29, 2002·63 cites·11 claims
- 1486US6709562B1Method of making electroplated interconnection structures on integrated circuit chipsIBM·Filed 1999·Granted Mar 23, 2004·90 cites·49 claims
- 1585US11049537B2Additive patterning of semiconductor film stacksAPPLIED MATERIALS INC·Filed 2019·Granted Jun 29, 2021·2 cites·14 claims
- 1683US7214297B2Substrate support element for an electrochemical plating cellAPPLIED MATERIALS INC·Filed 2004·Granted May 8, 2007·30 cites·16 claims
- 1780US6251251B1Anode design for semiconductor depositionIBM·Filed 1998·Granted Jun 26, 2001·35 cites·27 claims
- 1876US6946716B2Electroplated interconnection structures on integrated circuit chipsIBM·Filed 2004·Granted Sep 20, 2005·16 cites·27 claims
- 1968US7736928B2Precision printing electroplating through plating mask on a solar cell substrateAPPLIED MATERIALS INC·Filed 2006·Granted Jun 15, 2010·1 cites·25 claims
- 2066US11798606B2Additive patterning of semiconductor film stacksAPPLIED MATERIALS INC·Filed 2021·Granted Oct 24, 2023·0 cites·6 claims
- 2163US7504335B2Grafted seed layer for electrochemical platingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 17, 2009·2 cites·14 claims
- 2262US11934103B2Apparatus for post exposure bake of photoresistAPPLIED MATERIALS INC·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 2358US2011031113A1Electroplating apparatusLOPATIN SERGEY·Filed 2010·Application pending·0 cites
- 2456US7820472B2Method of forming front contacts to a silicon solar cell without patterningAPPLIED MATERIALS INC·Filed 2008·Granted Oct 26, 2010·0 cites·22 claims
- 2555US11018223B2Methods for forming device isolation for semiconductor applicationsAPPLIED MATERIALS INC·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 2654US2008128019A1Method of metallizing a solar cell substrateAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2749US2022199414A1Apparatus for post exposure bake of photoresistAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2849US2005274620A1Copper replenishment system for interconnect applicationsKOVARSKY NICOLAY Y·Filed 2004·Application pending·0 cites
- 2948US2006102467A1Current collimation for thin seed and direct platingHERCHEN HARALD·Filed 2004·Application pending·0 cites
- 3048US2008092947A1Pulse plating of a low stress film on a solar cell substrateAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3148US2006017169A1Electroplated interconnection structures on integrated circuit chipsIBM·Filed 2005·Application pending·0 cites
- 3239US2005145499A1Plating of a thin metal seed layerAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3339US2007125657A1Method of direct plating of copper on a substrate structureSUN ZHI-WEN·Filed 2005·Application pending·0 cites
- 3438US2005284751A1Electrochemical plating cell with a counter electrode in an isolated anolyte compartmentKOVARSKY NICOLAY·Filed 2004·Application pending·0 cites
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