Inventor · disambiguated record
Zhiyong Suo
Also filed as: SUO ZHIYONG
1 granted patent·3 pending applications·0 citations·filing 2021–2025
14Inventor score
Technology areasH10W
Files withYANGTZE MEMORY TECH CO LTD4
Top patents by PatentIndex Score
4 records- 0176US2025349601A1Wafer bonding method and bonded waferYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0276US2025349602A1Wafer bonding method and bonded waferYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0363US12381111B2Wafer bonding method and bonded waferYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 5, 2025·0 cites·7 claims
- 0454US2024404901A1Package structures, fabricating methods thereof, and memory systemsYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Zhiyong Suo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →