Inventor · disambiguated record
Kaun-I Cheng
Also filed as: CHENG KAUN-I
8 granted patents·2 pending applications·9 citations·filing 2004–2025
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0193US11728178B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 15, 2023·3 cites·7 claims
- 0289US2025357143A1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 0384US12394636B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·7 claims
- 0479US12033868B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Jul 9, 2024·0 cites·5 claims
- 0577US9997469B2Electronic package having a protruding barrier frameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jun 12, 2018·3 cites·6 claims
- 0673US10396040B2Method for fabricating electronic package having a protruding barrier frameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Aug 27, 2019·2 cites·8 claims
- 0768US10950520B2Electronic package, method for fabricating the same, and heat dissipatorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Mar 16, 2021·1 cites·27 claims
- 0855US10903088B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jan 26, 2021·0 cites·6 claims
- 0942US9171741B2Packaging substrate and fabrication method thereofWANG WEI-PING·Filed 2012·Granted Oct 27, 2015·0 cites·11 claims
- 1034US2004238923A1Surface-mount-enhanced lead frame and method for fabricating semiconductor package with the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →