Inventor · disambiguated record
Hsien-Lung Hsiao
Also filed as: HSIAO HSIEN-LUNG
5 granted patents·1 pending application·3 citations·filing 2017–2025
68Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD6
Top patents by PatentIndex Score
6 records- 0193US11728178B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 15, 2023·3 cites·7 claims
- 0289US2025357143A1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 0384US12394636B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·7 claims
- 0479US12033868B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Jul 9, 2024·0 cites·5 claims
- 0555US10903088B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jan 26, 2021·0 cites·6 claims
- 0645US11239125B2Carrier structure and package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Feb 1, 2022·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →