Inventor · disambiguated record
Kwang Hong Lee
Also filed as: LEE KWANG HONG
9 granted patents·2 pending applications·7 citations·filing 2015–2019
77Inventor score
Top patents by PatentIndex Score
11 records- 0182US10049947B2Method of manufacturing a substrateMASSACHUSETTS INST TECHNOLOGY·Filed 2015·Granted Aug 14, 2018·5 cites·18 claims
- 0267US10049916B2Method of manufacturing a germanium-on-insulator substrateMASSACHUSETTS INST TECHNOLOGY·Filed 2015·Granted Aug 14, 2018·2 cites·19 claims
- 0347US2019035628A1Method and structure for reducing substrate fragilityMASSACHUSETTS INST TECHNOLOGY·Filed 2017·Application pending·0 cites
- 0446US10672608B2Fabrication of a device on a carrier substrateMASSACHUSETTS INST TECHNOLOGY·Filed 2017·Granted Jun 2, 2020·0 cites·17 claims
- 0545US10598853B2Optical structure and method of forming the sameUNIV NANYANG TECH·Filed 2017·Granted Mar 24, 2020·0 cites·20 claims
- 0643US11901186B2Method of reducing semiconductor substrate surface unevennessMASSACHUSETTS INST TECHNOLOGY·Filed 2019·Granted Feb 13, 2024·0 cites·14 claims
- 0742US10483351B2Method of manufacturing a substrate with reduced threading dislocation densityUNIV NANYANG TECH·Filed 2016·Granted Nov 19, 2019·0 cites·8 claims
- 0840US10847553B2Method of forming a multilayer structure for a pixelated display and a multilayer structure for a pixelated displayMASSACHUSETTS INST TECHNOLOGY·Filed 2018·Granted Nov 24, 2020·0 cites·23 claims
- 0938US10418273B2Method of manufacturing a germanium-on-insulator substrateUNIV NANYANG TECH·Filed 2016·Granted Sep 17, 2019·0 cites·27 claims
- 1035US10510560B2Method of encapsulating a substrateUNIV NANYANG TECH·Filed 2016·Granted Dec 17, 2019·0 cites·19 claims
- 1133US2018330982A1Method of manufacturing a hybrid substrateUNIV NANYANG TECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →