Inventor · disambiguated record
Joon-Gon Lee
Also filed as: LEE JOON GON
11 granted patents·2 pending applications·62 citations·filing 2010–2022
87Inventor score
Top patents by PatentIndex Score
13 records- 0196US10079210B2Integrated circuit device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 18, 2018·32 cites·20 claims
- 0294US10283600B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 7, 2019·13 cites·20 claims
- 0387US11367651B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·2 cites·18 claims
- 0484US10128245B2Semiconductor devices including active areas with increased contact areaSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 13, 2018·4 cites·20 claims
- 0583US10262937B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 16, 2019·4 cites·15 claims
- 0680US10332984B2Semiconductor devices having reduced contact resistanceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 25, 2019·3 cites·7 claims
- 0773US10115806B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 30, 2018·2 cites·11 claims
- 0866US12165916B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 0959US8470703B2Semiconductor device and method of fabricating the sameLEE BYUNG-HAK·Filed 2011·Granted Jun 25, 2013·2 cites·16 claims
- 1040US8530303B2Method of fabricating semiconductor deviceKIM JIN-BUM·Filed 2011·Granted Sep 10, 2013·0 cites·7 claims
- 1140US2019115451A1Methods of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1239US9728465B2Semiconductor devices with improved source/drain contact resistance and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 8, 2017·0 cites·21 claims
- 1334US2010227479A1Semiconductor device and associated methods of manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →