Inventor · disambiguated record
Yasuo Souki
Also filed as: SOUKI YASUO
8 granted patents·218 citations·filing 1994–2006
89Inventor score
Top patents by PatentIndex Score
8 records- 0193US7550367B2Method for separating semiconductor substrateDENSO CORP·Filed 2005·Granted Jun 23, 2009·29 cites·8 claims
- 0290US6245593B1Semiconductor device with flat protective adhesive sheet and method of manufacturing the sameDENSO CORP·Filed 1999·Granted Jun 12, 2001·99 cites·23 claims
- 0377US7572659B2Semiconductor dynamic sensor and method of manufacturing the sameDENSO CORP·Filed 2006·Granted Aug 11, 2009·11 cites·10 claims
- 0474US5714408AMethod of forming silicon nitride with varied hydrogen concentrationDENSO CORP·Filed 1996·Granted Feb 3, 1998·33 cites·11 claims
- 0563US6787929B2Semiconductor device having a flat protective adhesive sheetDENSO CORP·Filed 2001·Granted Sep 7, 2004·7 cites·11 claims
- 0657US5874365ASemiconductor wafer etching methodNIPPON DENSO CO·Filed 1994·Granted Feb 23, 1999·22 cites·22 claims
- 0746US6251542B1Semiconductor wafer etching methodNIPPON DENSO CO·Filed 1998·Granted Jun 26, 2001·10 cites·33 claims
- 0842US6137156ASemiconductor device employing silicon nitride layers with varied hydrogen concentrationDENSO CORP·Filed 1998·Granted Oct 24, 2000·7 cites·31 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →