Inventor · disambiguated record
Daisuke Fujimoto
Also filed as: FUJIMOTO DAISUKE
19 granted patents·17 pending applications·187 citations·filing 1997–2025
93Inventor score
Files withHITACHI CHEMICAL CO LTD12RESONAC CORP6FUJIMOTO DAISUKE5MIZUNO YASUYUKI4SHOWA DENKO MATERIALS CO LTD4
Top patents by PatentIndex Score
36 records- 0189US5879568AProcess for producing multilayer printed circuit board for wire bondingHITACHI LTD·Filed 1997·Granted Mar 9, 1999·126 cites·8 claims
- 0280US10776484B2On-chip monitor circuit and semiconductor chipUNIV KOBE NAT UNIV CORP·Filed 2016·Granted Sep 15, 2020·4 cites·15 claims
- 0376US6667107B2Thermosetting resin composition and use thereofHITACHI CHEMICAL CO LTD·Filed 2002·Granted Dec 23, 2003·18 cites·30 claims
- 0473US9661763B2Structure containing conductor circuit, method for manufacturing same, and heat-curable resin compositionHITACHI CHEMICAL CO LTD·Filed 2012·Granted May 23, 2017·4 cites·24 claims
- 0571US8568891B2Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the sameMIZUNO YASUYUKI·Filed 2012·Granted Oct 29, 2013·3 cites·17 claims
- 0670US12256490B2Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2018·Granted Mar 18, 2025·0 cites·16 claims
- 0770US8404769B2Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminateFUJIMOTO DAISUKE·Filed 2008·Granted Mar 26, 2013·2 cites·29 claims
- 0868US7157506B2Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminateHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jan 2, 2007·7 cites·16 claims
- 0966US2025234456A1Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor packageRESONAC CORP·Filed 2025·Application pending·0 cites
- 1064US2023095879A1Method for using a buffer sheetSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 1163US8277948B2Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the sameMIZUNO YASUYUKI·Filed 2007·Granted Oct 2, 2012·3 cites·17 claims
- 1261US12264224B2Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor packageSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Apr 1, 2025·0 cites·19 claims
- 1358US9873771B2Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jan 23, 2018·1 cites·16 claims
- 1458US7816430B2Composition of polycyanate ester and biphenyl epoxy resinHITACHI CHEMICAL CO LTD·Filed 2003·Granted Oct 19, 2010·3 cites·29 claims
- 1558US2018340056A1Buffer sheet composition and buffer sheetHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 1657US2007207326A1Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnishMIZUNO YASUYUKI·Filed 2006·Application pending·0 cites
- 1754US7078106B2Thermosetting resin composition and use thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jul 18, 2006·1 cites·10 claims
- 1853US6197149B1Production of insulating varnishes and multilayer printed circuit boards using these varnishesHITACHI CHEMICAL CO LTD·Filed 1998·Granted Mar 6, 2001·15 cites·13 claims
- 1953US2025159815A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 2053US2025142722A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 2152US2025024609A1Wiring-forming member, wiring layer forming method using wiring-forming member, and wiring-formed memberRESONAC CORP·Filed 2022·Application pending·0 cites
- 2251US2023392002A1Method for evaluating compatibility of thermosetting resin composition, thermosetting resin composition, prepreg, resin film, laminated plate, multilayer printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Application pending·0 cites
- 2350US2024079345A1Electroconductive member, method for manufacturing electronic device, connection structure, and electronic deviceSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 2449US8501870B2Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the sameMIZUNO YASUYUKI·Filed 2012·Granted Aug 6, 2013·0 cites·25 claims
- 2549US2022243962A1Refrigerant cycle systemDAIKIN IND LTD·Filed 2022·Application pending·0 cites
- 2648US2009323300A1Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring BoardFUJIMOTO DAISUKE·Filed 2007·Application pending·0 cites
- 2748US2025236723A1Resin sheet, laminated board, metal-clad laminated board, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Application pending·0 cites
- 2847US2013040153A1Process for producing resin varnish containing semi-ipn composite, thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminateFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
- 2945US11049825B2Method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Jun 29, 2021·0 cites·10 claims
- 3044US10034384B2Structure containing conductor circuit, method for manufacturing same, and heat-curable resin compositionHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jul 24, 2018·0 cites·24 claims
- 3141US2014151091A1Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for sameFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
- 3240US2004011429A1Zinc phosphate-containing surface conditioning agent phosphate conversion-treated steel plate and painted steel plate, and zinc phosphate dispersionNIPPON PAINT CO LTD·Filed 2003·Application pending·0 cites
- 3339US10464502B2Roof ditch molding end capNISSAN NORTH AMERICA INC·Filed 2018·Granted Nov 5, 2019·0 cites·15 claims
- 3437US2012305291A1Primer layer for plating process, laminate for wiring board and method for manufacture thereof, multilayer wiring board and method for manufacture thereofFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
- 3536US11795293B2Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 24, 2023·0 cites·14 claims
- 3635US2021206906A1Resin composition, resin member, resin sheet, b-stage sheet, c-stage sheet, metal foil with resin, metal substrate, and power semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →