Inventor · disambiguated record
Jinkyeong Seol
Also filed as: SEOL JINKYEONG
6 granted patents·7 pending applications·9 citations·filing 2018–2024
73Inventor score
Files withSAMSUNG ELECTRONICS CO LTD13
Top patents by PatentIndex Score
13 records- 0191US11694996B2Semiconductor package including a pad contacting a viaSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 4, 2023·2 cites·17 claims
- 0286US10510672B2Semiconductor packages and methods of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 17, 2019·6 cites·20 claims
- 0383US11552033B2Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·1 cites·18 claims
- 0479US2025015026A1Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0576US12132019B2Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 0668US11557574B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 0760US2025157908A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0859US11075189B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 27, 2021·0 cites·20 claims
- 0957US2025157980A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1057US2025006676A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1157US2025140723A1Semiconductor package and method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1256US2025029942A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1356US2024404970A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →