Inventor · disambiguated record
Wun-Jheng Syu
Also filed as: SYU Wun-Jheng
6 granted patents·27 citations·filing 2016–2019
79Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG6
Top patents by PatentIndex Score
6 records- 0192US10157887B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Dec 18, 2018·9 cites·20 claims
- 0286US10629519B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Apr 21, 2020·6 cites·22 claims
- 0386US10573624B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Feb 25, 2020·4 cites·19 claims
- 0485US10134683B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 20, 2018·6 cites·21 claims
- 0577US10224298B2Semiconductor package device having glass transition temperature greater than binding layer temperatureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 5, 2019·2 cites·19 claims
- 0657US10734337B2Semiconductor package device having glass transition temperature greater than binding layer temperatureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 4, 2020·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →