Inventor · disambiguated record
Tomoko Tamura
Also filed as: TAMURA TOMOKO
18 granted patents·5 pending applications·456 citations·filing 1995–2021
95Inventor score
Files withSEMICONDUCTOR ENERGY LAB13DAIRIKI KOJI2MITSUBISHI HEAVY IND LTD2DOZEN YOSHITAKA1HITACHI SOLUTIONS LTD1
Top patents by PatentIndex Score
23 records- 0198US7465674B2Manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Dec 16, 2008·85 cites·17 claims
- 0297US7927971B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted Apr 19, 2011·42 cites·21 claims
- 0397US7482248B2Manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted Jan 27, 2009·66 cites·52 claims
- 0497US7452786B2Method for manufacturing thin film integrated circuit, and element substrateSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted Nov 18, 2008·70 cites·27 claims
- 0597US7282380B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted Oct 16, 2007·71 cites·31 claims
- 0694US7704765B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2007·Granted Apr 27, 2010·28 cites·20 claims
- 0792US8030132B2Manufacturing method of semiconductor device including peeling stepSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Oct 4, 2011·23 cites·20 claims
- 0890US7588969B2Method for manufacturing semiconductor device, and semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Sep 15, 2009·15 cites·50 claims
- 0989US7504317B2Manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Mar 17, 2009·14 cites·13 claims
- 1086US7939385B2Method for manufacturing thin film integrated circuit, and element substrateSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted May 10, 2011·9 cites·50 claims
- 1186US7534702B2Method for manufacturing a semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted May 19, 2009·11 cites·19 claims
- 1283US8236629B2Method for manufacturing thin film integrated circuit, and element substrateDOZEN YOSHITAKA·Filed 2011·Granted Aug 7, 2012·5 cites·22 claims
- 1381US8530335B2Method for manufacturing semiconductor deviceTAMURA TOMOKO·Filed 2011·Granted Sep 10, 2013·5 cites·44 claims
- 1480US9941115B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2013·Granted Apr 10, 2018·3 cites·23 claims
- 1569US7875530B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Jan 25, 2011·4 cites·40 claims
- 1668US8790994B2Wireless chip and manufacturing method thereofDAIRIKI KOJI·Filed 2012·Granted Jul 29, 2014·2 cites·18 claims
- 1762US8288773B2Wireless chip and manufacturing method thereofDAIRIKI KOJI·Filed 2005·Granted Oct 16, 2012·2 cites·48 claims
- 1856US2021331247A1Method of producing additively manufactured object and additively manufactured objectMITSUBISHI HEAVY IND LTD·Filed 2021·Application pending·0 cites
- 1949US2011198543A1Aqueous dispersion of fine carbon fibers, method for preparing the aqueous dispersion, and articles using thereofHODOGAYA CHEMICAL CO LTD·Filed 2009·Application pending·0 cites
- 2044US2021040594A1Method of manufacturing metal memberMITSUBISHI HEAVY IND LTD·Filed 2017·Application pending·0 cites
- 2138US2018135186A1Oxide film removing methodMITSUBISHI HEAVY IND AERO ENGINES LTD·Filed 2016·Application pending·0 cites
- 2233US5869536ATreatment of hyperkinetic disordersMITSUBISHI CHEM CORP·Filed 1995·Granted Feb 9, 1999·1 cites·3 claims
- 2328US2015049900A1Information provision systemHITACHI SOLUTIONS LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →