Inventor · disambiguated record
Byeongdeck Jang
Also filed as: JANG BYEONGDECK
22 granted patents·2 pending applications·8 citations·filing 2017–2024
89Inventor score
Files withDISCO CORP24
Top patents by PatentIndex Score
24 records- 0180US10937668B2Semiconductor package manufacturing methodDISCO CORP·Filed 2019·Granted Mar 2, 2021·3 cites·9 claims
- 0277US10403520B2Multi-blade and processing method of workpieceDISCO CORP·Filed 2018·Granted Sep 3, 2019·3 cites·3 claims
- 0367US11183464B2Package substrate processing method and protective tapeDISCO CORP·Filed 2018·Granted Nov 23, 2021·1 cites·14 claims
- 0466US10211164B2Semiconductor package manufacturing methodDISCO CORP·Filed 2017·Granted Feb 19, 2019·1 cites·3 claims
- 0558US11590629B2Method of processing workpiece and resin sheet unitDISCO CORP·Filed 2019·Granted Feb 28, 2023·0 cites·20 claims
- 0658US2025118561A1Workpiece processing methodDISCO CORP·Filed 2024·Application pending·0 cites
- 0755US11764115B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 19, 2023·0 cites·16 claims
- 0854US12300545B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted May 13, 2025·0 cites·18 claims
- 0954US11854891B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 1054US11764114B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 19, 2023·0 cites·17 claims
- 1154US11756831B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 12, 2023·0 cites·19 claims
- 1252US12198990B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Jan 14, 2025·0 cites·12 claims
- 1350US11133198B2Method of manufacturing packaged device chipDISCO CORP·Filed 2020·Granted Sep 28, 2021·0 cites·6 claims
- 1449US11682569B2Workpiece cutting methodDISCO CORP·Filed 2020·Granted Jun 20, 2023·0 cites·4 claims
- 1548US11289348B2Workpiece processing methodDISCO CORP·Filed 2019·Granted Mar 29, 2022·0 cites·3 claims
- 1647US11508607B2Method of processing workpiece and resin sheet unitDISCO CORP·Filed 2019·Granted Nov 22, 2022·0 cites·2 claims
- 1746US10861716B2Processing method for package substrateDISCO CORP·Filed 2019·Granted Dec 8, 2020·0 cites·4 claims
- 1845US10366907B2Manufacturing method of semiconductor packageDISCO CORP·Filed 2018·Granted Jul 30, 2019·0 cites·2 claims
- 1944US11322476B2Manufacturing method of producing shielded individual semiconductor packagesDISCO CORP·Filed 2019·Granted May 3, 2022·0 cites·6 claims
- 2042US11114385B2Plate-shaped workpiece processing methodDISCO CORP·Filed 2019·Granted Sep 7, 2021·0 cites·5 claims
- 2141US10515841B2Method for dividing substrate along division lines using abrasive member having projection for cutting substrateDISCO CORP·Filed 2018·Granted Dec 24, 2019·0 cites·4 claims
- 2241US10431555B2Method of manufacturing semiconductor packageDISCO CORP·Filed 2018·Granted Oct 1, 2019·0 cites·12 claims
- 2340US10497623B2Method of manufacturing a semiconductor package including a shield layerDISCO CORP·Filed 2018·Granted Dec 3, 2019·0 cites·10 claims
- 2440US2019006290A1Semiconductor package and semiconductor package manufacturing methodDISCO CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →