Inventor · disambiguated record
Gopalakrishnan Trichy Rengarajan
Also filed as: TRICHY RENGARAJAN GOPALAKRISHNAN
6 granted patents·1 pending application·0 citations·filing 2012–2021
66Inventor score
Top patents by PatentIndex Score
7 records- 0159US11848213B2Semiconductor module having a layer that includes inorganic filler and a casting materialINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 19, 2023·0 cites·5 claims
- 0252US9349794B2Layer arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 24, 2016·0 cites·12 claims
- 0349US11121004B2Semiconductor module and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 14, 2021·0 cites·16 claims
- 0443US8772948B2Method for manufacturing a layer arrangement, and a layer arrangementTRICHY RENGARAJAN GOPALAKRISHNAN·Filed 2012·Granted Jul 8, 2014·0 cites·22 claims
- 0542US8916453B2Method for manufacturing an electronic componentINFINEON TECHNOLOGIES AG·Filed 2012·Granted Dec 23, 2014·0 cites·26 claims
- 0640US2020343107A1Semiconductor Module and Method for Producing the SameINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 0732US9978711B2Method for connecting a semiconductor chip metal surface of a substrate by means of two contact metallization layers and method for producing an electronic moduleINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 22, 2018·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →