Inventor · disambiguated record
Hyun Hak Jung
Also filed as: JUNG HYUN HAK
6 granted patents·1 pending application·48 citations·filing 2013–2016
76Inventor score
Top patents by PatentIndex Score
7 records- 0192US9466586B1Method for manufacturing wafer-level fan-out packageSTS SC & TELECOMM CO LTD·Filed 2015·Granted Oct 11, 2016·35 cites·6 claims
- 0289US9935072B2Semiconductor package and method for manufacturing the sameSFA SEMICON CO LTD·Filed 2016·Granted Apr 3, 2018·11 cites·13 claims
- 0368US10103117B2Method of manufacturing fan-out type wafer level packageSFA SEMICON CO LTD·Filed 2016·Granted Oct 16, 2018·2 cites·3 claims
- 0443US9347806B2Sensor having an embedded electrode, and method for manufacturing sameJOINSET CO LTD·Filed 2013·Granted May 24, 2016·0 cites·12 claims
- 0542US10050499B2Method of manufacturing voice coilSTS SC & TELECOMM CO LTD·Filed 2015·Granted Aug 14, 2018·0 cites·10 claims
- 0632US9349667B2Method of manufacturing stacked packageSTS SC & TELECOMM CO LTD·Filed 2014·Granted May 24, 2016·0 cites·9 claims
- 0732US2016365195A1Method for manufacturing voice coilSTS SC & TELECOMM CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →