Inventor · disambiguated record
Yoshikatsu Umeda
Also filed as: UMEDA YOSHIKATSU
5 granted patents·1 pending application·117 citations·filing 1999–2010
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0193US8294261B2Protruding TSV tips for enhanced heat dissipation for IC devicesMAWATARI KAZUAKI·Filed 2010·Granted Oct 23, 2012·37 cites·19 claims
- 0288US6713881B2Semiconductor device and method of manufacturing sameTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 30, 2004·64 cites·20 claims
- 0345US6268644B1Semiconductor deviceTEXAS INSTRUMENTS INC·Filed 1999·Granted Jul 31, 2001·16 cites·10 claims
- 0443US7926698B2Spot heat wirebondingTEXAS INSTRUMENTS INC·Filed 2010·Granted Apr 19, 2011·0 cites·8 claims
- 0543US7677432B2Spot heat wirebondingTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 16, 2010·0 cites·1 claims
- 0635US2005275073A1Method and system for improved wire bondingTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yoshikatsu Umeda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →