Inventor · disambiguated record
Haruhiko Sakai
Also filed as: SAKAI HARUHIKO
7 granted patents·2 pending applications·67 citations·filing 2002–2018
82Inventor score
Top patents by PatentIndex Score
9 records- 0183US10941787B2Power source integrated vacuum pump having a power source with a substrate in contact with and covering a portion of a cooling surface which is also covered by a heat insulating plateSHIMADZU CORP·Filed 2018·Granted Mar 9, 2021·3 cites·5 claims
- 0283US7030501B2Semiconductor device and switching elementKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Apr 18, 2006·47 cites·9 claims
- 0376US7839004B2Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frameSANYO ELECTRIC CO·Filed 2009·Granted Nov 23, 2010·7 cites·6 claims
- 0451US6833616B2Multilayer wiring board with mounting padSANYO ELECTRIC CO·Filed 2002·Granted Dec 21, 2004·5 cites·17 claims
- 0546US6833608B2Semiconductor device and packaging system thereforeSANYO ELECTRIC CO·Filed 2002·Granted Dec 21, 2004·3 cites·19 claims
- 0645US6818969B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2002·Granted Nov 16, 2004·2 cites·16 claims
- 0739US2016369844A1Slide rail and electronic apparatusFUJITSU LTD·Filed 2016·Application pending·0 cites
- 0837US8241958B2Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frameSAKAI HARUHIKO·Filed 2010·Granted Aug 14, 2012·0 cites·7 claims
- 0926US2015356042A1Computer system, switching device, and switching methodFUJITSU LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →