Inventor · disambiguated record
John J. Garant
Also filed as: GARANT JOHN · GARANT JOHN J · GARANT JOHN JOSEPH
20 granted patents·3 pending applications·105 citations·filing 1996–2022
94Inventor score
Top patents by PatentIndex Score
23 records- 0192US9805977B1Integrated circuit structure having through-silicon via and method of forming sameGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 31, 2017·16 cites·20 claims
- 0284US9278401B2Fill head interface with combination vacuum pressure chamberIBM·Filed 2013·Granted Mar 8, 2016·5 cites·16 claims
- 0379US7833897B2Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surfaceIBM·Filed 2007·Granted Nov 16, 2010·7 cites·6 claims
- 0478US9613842B2Wafer handler and methods of manufactureIBM·Filed 2014·Granted Apr 4, 2017·3 cites·14 claims
- 0572US7401637B2Pressure-only molten metal valving apparatus and methodIBM·Filed 2006·Granted Jul 22, 2008·3 cites·20 claims
- 0662US12334461B2Bonding structure using two oxide layers with different stress levels, and related methodGLOBALFOUNDRIES US INC·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 0762US6631675B2Screening method for double pass screeningIBM·Filed 2001·Granted Oct 14, 2003·5 cites·8 claims
- 0859US6224682B1CVD of metals capable of receiving nickel or alloys thereof using inert contactIBM·Filed 2000·Granted May 1, 2001·5 cites·20 claims
- 0955US6348233B2Method of forming conductive line features for enhanced reliability of multi-layer ceramic substratesIBM·Filed 2001·Granted Feb 19, 2002·7 cites·9 claims
- 1054US10049909B2Wafer handler and methods of manufactureGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 14, 2018·0 cites·17 claims
- 1153US5700549AStructure to reduce stress in multilayer ceramic substratesIBM·Filed 1996·Granted Dec 23, 1997·16 cites·10 claims
- 1251US8123088B2Dispensing assembly with a controlled gas environmentBIGGS GLEN NELSON·Filed 2008·Granted Feb 28, 2012·0 cites·24 claims
- 1351US6662718B2Screening mask having a stress-relieving areaIBM·Filed 2001·Granted Dec 16, 2003·2 cites·16 claims
- 1451US2015311161A1Selective plating without photoresistIBM·Filed 2014·Application pending·0 cites
- 1550US8123089B2Dispensing assembly with an injector controlled gas environmentBIGGS GLEN NELSON·Filed 2008·Granted Feb 28, 2012·0 cites·24 claims
- 1650US5755903AMethod of making a multilayer ceramic substrate having reduced stressIBM·Filed 1996·Granted May 26, 1998·14 cites·9 claims
- 1747US9498837B2Vacuum transition for solder bump mold fillingGARANT JOHN J·Filed 2009·Granted Nov 22, 2016·0 cites·9 claims
- 1846US6569496B1CVD of metals capable of receiving nickel or alloys thereof using inert contactIBM·Filed 1998·Granted May 27, 2003·10 cites·4 claims
- 1945US2015348910A1Selective plating without photoresistIBM·Filed 2015·Application pending·0 cites
- 2045US2009242614A1Method and tool for repositioning solder fill headIBM·Filed 2008·Application pending·0 cites
- 2136US6217989B1Conductive line features for enhanced reliability of multi-layer ceramic substratesIBM·Filed 1999·Granted Apr 17, 2001·6 cites·25 claims
- 2233US6227943B1Method and system for pre-cleaning and post-cleaning deposited metalIBM·Filed 1998·Granted May 8, 2001·3 cites·22 claims
- 2331US5866470AMethod of using an interface layer for stacked lamination sizing and sinteringIBM·Filed 1996·Granted Feb 2, 1999·3 cites·15 claims
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