Inventor · disambiguated record
John J. Konrad
Also filed as: KONRAD JOHN · KONRAD JOHN J · KONRAD JOHN JOSEPH
29 granted patents·3 pending applications·703 citations·filing 1991–2024
97Inventor score
Top patents by PatentIndex Score
32 records- 0198US6919514B2Structure having laser ablated features and method of fabricatingIBM·Filed 2003·Granted Jul 19, 2005·157 cites·12 claims
- 0298US6730857B2Structure having laser ablated features and method of fabricatingIBM·Filed 2001·Granted May 4, 2004·188 cites·9 claims
- 0390US5156730AElectrode array and use thereofIBM·Filed 1991·Granted Oct 20, 1992·107 cites·5 claims
- 0485US5733466AElectrolytic method of depositing gold connectors on a printed circuit boardIBM·Filed 1996·Granted Mar 31, 1998·79 cites·11 claims
- 0582US7169313B2Plating method for circuitized substratesENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jan 30, 2007·13 cites·15 claims
- 0680US7288177B2Selective shield/material flow mechanismIBM·Filed 2004·Granted Oct 30, 2007·12 cites·5 claims
- 0780US7007378B2Process for manufacturing a printed wiring boardIBM·Filed 2002·Granted Mar 7, 2006·23 cites·5 claims
- 0875US7087441B2Method of making a circuitized substrate having a plurality of solder connection sites thereonENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Aug 8, 2006·20 cites·52 claims
- 0975US6586683B2Printed circuit board with mixed metallurgy pads and method of fabricationIBM·Filed 2001·Granted Jul 1, 2003·15 cites·15 claims
- 1071US7910156B2Method of making circuitized substrate with selected conductors having solder thereonENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 22, 2011·6 cites·11 claims
- 1166US6524654B1Method of controlling the spread of an adhesive on a circuitized organic substrateIBM·Filed 2000·Granted Feb 25, 2003·10 cites·12 claims
- 1265US6746578B2Selective shield/material flow mechanismIBM·Filed 2001·Granted Jun 8, 2004·4 cites·30 claims
- 1364US7425256B2Selective shield/material flow mechanismIBM·Filed 2007·Granted Sep 16, 2008·0 cites·8 claims
- 1464US7163847B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jan 16, 2007·2 cites·16 claims
- 1564US6099959AMethod of controlling the spread of an adhesive on a circuitized organic substrateIBM·Filed 1998·Granted Aug 8, 2000·23 cites·2 claims
- 1660US6931722B2Method of fabricating printed circuit board with mixed metallurgy padsIBM·Filed 2003·Granted Aug 23, 2005·7 cites·19 claims
- 1756US6432182B1Treatment solution for reducing adhesive resin bleedIBM·Filed 2000·Granted Aug 13, 2002·5 cites·8 claims
- 1852US8288266B2Circuitized substrate assemblyCARD NORMAN A·Filed 2006·Granted Oct 16, 2012·1 cites·11 claims
- 1951US2024188217A1Systems and methods for forming stubless plated through holes having wrapping structures in printed circuit boardsTTM TECH INC·Filed 2024·Application pending·0 cites
- 2050US7084014B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Aug 1, 2006·3 cites·7 claims
- 2148US7091066B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Aug 15, 2006·0 cites·24 claims
- 2244US5893983ATechnique for removing defects from a layer of metalIBM·Filed 1996·Granted Apr 13, 1999·12 cites·12 claims
- 2341US6455139B2Process for reducing extraneous metal platingIBM·Filed 2001·Granted Sep 24, 2002·0 cites·20 claims
- 2439US6534186B2Chip carriers with enhanced wire bondabilityIBM·Filed 2001·Granted Mar 18, 2003·0 cites·1 claims
- 2538US2012243155A1Conductive metal nub for enhanced electrical interconnection, and information handling system utilizing sameMATIENZO LUIS J·Filed 2011·Application pending·0 cites
- 2635US2022053641A1Systems and methods for removing undesired metal within vias from printed circuit boardsTTM TECH INC·Filed 2021·Application pending·0 cites
- 2734US6485892B1Method for masking a hole in a substrate during platingIBM·Filed 1999·Granted Nov 26, 2002·4 cites·13 claims
- 2832US6251469B1Method of rendering a substrate selectively non-wettable chip carrier with enhanced wire bondabilityIBM·Filed 1997·Granted Jun 26, 2001·2 cites·19 claims
- 2931US7635552B2Photoresist composition with antibacterial agentENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Dec 22, 2009·0 cites·23 claims
- 3031US6372101B1Apparatus for preventing drag-outIBM·Filed 1999·Granted Apr 16, 2002·7 cites·20 claims
- 3131US6296897B1Process for reducing extraneous metal platingIBM·Filed 1998·Granted Oct 2, 2001·1 cites·20 claims
- 3225US5723339AMethod of analyzing gold electroplating solutions for arsenic(III)IBM·Filed 1996·Granted Mar 3, 1998·2 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →