Inventor · disambiguated record
Donald F. Canaperi
Also filed as: CANAPERI DONALD · CANAPERI DONALD F · CANAPERI DONALD FRANCIS
76 granted patents·6 pending applications·1,532 citations·filing 1986–2023
99Inventor score
Top patents by PatentIndex Score
82 records- 0199US10553522B1Semiconductor microcoolerIBM·Filed 2018·Granted Feb 4, 2020·20 cites·6 claims
- 0299US7045453B2Very low effective dielectric constant interconnect structures and methods for fabricating the sameIBM·Filed 2005·Granted May 16, 2006·221 cites·9 claims
- 0398US10395986B1Fully aligned via employing selective metal depositionIBM·Filed 2018·Granted Aug 27, 2019·24 cites·19 claims
- 0498US6621392B1Micro electromechanical switch having self-aligned spacersIBM·Filed 2002·Granted Sep 16, 2003·211 cites·20 claims
- 0598US6524935B1Preparation of strained Si/SiGe on insulator by hydrogen induced layer transfer techniqueIBM·Filed 2000·Granted Feb 25, 2003·250 cites·31 claims
- 0697US9754798B1Hybridization fin reveal for uniform fin reveal depth across different fin pitchesIBM·Filed 2016·Granted Sep 5, 2017·17 cites·16 claims
- 0797US9466538B1Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding processGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 11, 2016·43 cites·17 claims
- 0896US7023093B2Very low effective dielectric constant interconnect Structures and methods for fabricating the sameIBM·Filed 2002·Granted Apr 4, 2006·112 cites·22 claims
- 0995US9679780B1Polysilicon residue removal in nanosheet MOSFETsIBM·Filed 2016·Granted Jun 13, 2017·11 cites·20 claims
- 1094US10553516B1Semiconductor microcoolerIBM·Filed 2018·Granted Feb 4, 2020·10 cites·6 claims
- 1194US6475072B1Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP)IBM·Filed 2000·Granted Nov 5, 2002·86 cites·16 claims
- 1293US10468585B1Dual function magnetic tunnel junction pillar encapsulationIBM·Filed 2018·Granted Nov 5, 2019·7 cites·20 claims
- 1393US6348076B1Slurry for mechanical polishing (CMP) of metals and use thereofIBM·Filed 1999·Granted Feb 19, 2002·147 cites·26 claims
- 1489US6812193B2Slurry for mechanical polishing (CMP) of metals and use thereofIBM·Filed 2002·Granted Nov 2, 2004·53 cites·29 claims
- 1588US9312224B1Interconnect structure containing a porous low k interconnect dielectric/dielectric capIBM·Filed 2014·Granted Apr 12, 2016·9 cites·21 claims
- 1687US10937789B2Nanosheet eDRAMIBM·Filed 2018·Granted Mar 2, 2021·4 cites·10 claims
- 1787US10490480B1Copper microcooler structure and fabricationIBM·Filed 2018·Granted Nov 26, 2019·4 cites·25 claims
- 1887US9558934B2Hydrogen-free silicon-based deposited dielectric films for nano device fabricationIBM·Filed 2015·Granted Jan 31, 2017·3 cites·7 claims
- 1987US9275874B2Methods for fabricating integrated circuits using chemical mechanical planarization to recess metalGLOBALFOUNDRIES INC·Filed 2013·Granted Mar 1, 2016·7 cites·19 claims
- 2086US9209017B2Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursorsIBM·Filed 2014·Granted Dec 8, 2015·5 cites·20 claims
- 2185US10490481B1Copper microcooler structure and fabricationIBM·Filed 2018·Granted Nov 26, 2019·3 cites·20 claims
- 2284US12208386B23D nanochannel interleaved devicesIBM·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 2384US6597068B2Encapsulated metal structures for semiconductor devices and MIM capacitors including the sameIBM·Filed 2001·Granted Jul 22, 2003·27 cites·6 claims
- 2483US6368953B1Encapsulated metal structures for semiconductor devices and MIM capacitors including the sameIBM·Filed 2000·Granted Apr 9, 2002·27 cites·4 claims
- 2582US10832917B2Low oxygen cleaning for CMP equipmentIBM·Filed 2017·Granted Nov 10, 2020·3 cites·11 claims
- 2681US7407605B2Manufacturable CoWP metal cap process for copper interconnectsIBM·Filed 2007·Granted Aug 5, 2008·8 cites·3 claims
- 2781US5635253AMethod of replenishing electroless gold plating bathsIBM·Filed 1995·Granted Jun 3, 1997·56 cites·16 claims
- 2881US5516416AApparatus and method for electroplating pin grid array packaging modulesIBM·Filed 1994·Granted May 14, 1996·30 cites·18 claims
- 2979US9087796B2Semiconductor fabrication method using stop layerIBM·Filed 2013·Granted Jul 21, 2015·4 cites·14 claims
- 3077US12100653B2Resistance tunable fuse structure formed by embedded thin metal layersIBM·Filed 2023·Granted Sep 24, 2024·0 cites·17 claims
- 3177US9711456B2Composite manganese nitride/low-K dielectric capIBM·Filed 2015·Granted Jul 18, 2017·2 cites·13 claims
- 3276US10366928B2Hybridization fin reveal for uniform fin reveal depth across different fin pitchesIBM·Filed 2017·Granted Jul 30, 2019·1 cites·18 claims
- 3373US9997352B2Polysilicon residue removal in nanosheet MOSFETsIBM·Filed 2017·Granted Jun 12, 2018·1 cites·20 claims
- 3473US9640514B1Wafer bonding using boron and nitrogen based bonding stackGLOBALFOUNDRIES INC·Filed 2016·Granted May 2, 2017·2 cites·17 claims
- 3572US11779918B23D nanochannel interleaved devicesIBM·Filed 2019·Granted Oct 10, 2023·0 cites·7 claims
- 3672US11031250B2Semiconductor structures of more uniform thicknessIBM·Filed 2018·Granted Jun 8, 2021·1 cites·12 claims
- 3772US6114249AChemical mechanical polishing of multiple material substrates and slurry having improved selectivityIBM·Filed 1998·Granted Sep 5, 2000·42 cites·5 claims
- 3871US10224283B2Composite manganese nitride / low-k dielectric capIBM·Filed 2017·Granted Mar 5, 2019·1 cites·20 claims
- 3971US5576099AInductive head lamination with layer of magnetic quenching materialIBM·Filed 1990·Granted Nov 19, 1996·21 cites·10 claims
- 4070US10242882B2Cyclic etch process to remove dummy gate oxide layer for fin field effect transistor fabricationIBM·Filed 2017·Granted Mar 26, 2019·1 cites·16 claims
- 4170US6756624B2Encapsulated metal structures for semiconductor devices and MIM capacitors including the sameIBM·Filed 2003·Granted Jun 29, 2004·11 cites·5 claims
- 4269US11676894B2Resistance tunable fuse structure formed by embedded thin metal layersIBM·Filed 2021·Granted Jun 13, 2023·0 cites·14 claims
- 4368US11791398B2Nano multilayer carbon-rich low-k spacerIBM·Filed 2020·Granted Oct 17, 2023·0 cites·18 claims
- 4468US8110321B2Method of manufacture of damascene reticlePETRARCA KEVIN S·Filed 2007·Granted Feb 7, 2012·2 cites·20 claims
- 4564US6762667B2Micro electromechanical switch having self-aligned spacersIBM·Filed 2003·Granted Jul 13, 2004·10 cites·8 claims
- 4663US10971675B2Dual function magnetic tunnel junction pillar encapsulationIBM·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 4762US10163721B2Hybridization fin reveal for uniform fin reveal depth across different fin pitchesIBM·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 4862US7199450B2Materials and method to seal vias in silicon substratesIBM·Filed 2005·Granted Apr 3, 2007·2 cites·7 claims
- 4961US10957642B1Resistance tunable fuse structure formed by embedded thin metal layersIBM·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 5060US10937892B2Nano multilayer carbon-rich low-k spacerIBM·Filed 2018·Granted Mar 2, 2021·0 cites·15 claims
Showing the top 50 of 82 patent records by PatentIndex Score.
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