Inventor · disambiguated record
Seiichi Hitomi
Also filed as: HITOMI SEIICHI
18 granted patents·13 pending applications·16 citations·filing 2010–2022
88Inventor score
Top patents by PatentIndex Score
31 records- 0189US10989846B2Near infrared absorbing composition, near infrared cut filter, method of manufacturing near infrared cut filter, solid image pickup element, camera module, and image display deviceFUJIFILM CORP·Filed 2018·Granted Apr 27, 2021·3 cites·18 claims
- 0285US12030774B2Surface-modified inorganic nitride, composition, thermally conductive material, and device with thermally conductive layerFUJIFILM CORP·Filed 2020·Granted Jul 9, 2024·1 cites·20 claims
- 0384US9618666B2Near-infrared-absorbing composition, near-infrared cut-off filter using same, manufacturing method therefor, camera module, and manufacturing method thereforFUJIFILM CORP·Filed 2015·Granted Apr 11, 2017·5 cites·58 claims
- 0477US9323145B2Colored radiation-sensitive composition, colored cured film, color filter, pattern forming method, color filter production method, solid-state image sensor, and image display deviceFUJIFILM CORP·Filed 2014·Granted Apr 26, 2016·2 cites·27 claims
- 0576US9826129B2Near-infrared-ray-absorbing composition, near-infrared-ray cut filter using same, manufacturing method therefor, camera module, and manufacturing method thereforFUJIFILM CORP·Filed 2015·Granted Nov 21, 2017·2 cites·12 claims
- 0668US9268063B2Colored radiation-sensitive composition, colored cured film, color filter, colored pattern forming method, color filter production method, solid-state image sensor, and image display deviceFUJIFILM CORP·Filed 2014·Granted Feb 23, 2016·1 cites·37 claims
- 0766US10215898B2Near infrared ray absorbent composition, near infrared ray cut filter, solid image pickup element, and camera moduleFUJIFILM CORP·Filed 2017·Granted Feb 26, 2019·1 cites·20 claims
- 0865US2021403786A1Composition and thermally conductive materialFUJIFILM CORP·Filed 2021·Application pending·0 cites
- 0964US12391859B2Composition for forming thermally conductive material, and thermally conductive materialFUJIFILM CORP·Filed 2021·Granted Aug 19, 2025·0 cites·12 claims
- 1064US10184052B2Near infrared radiation-absorbing composition, near infrared radiation cut-off filter and production method therefor, and camera module and production method thereforFUJIFILM CORP·Filed 2016·Granted Jan 22, 2019·1 cites·17 claims
- 1163US12448555B2Composition for forming thermally conductive material, thermally conductive material, and surface-modified inorganic substanceFUJIFILM CORP·Filed 2022·Granted Oct 21, 2025·0 cites·19 claims
- 1259US2014151615A1Coloring composition, colored cured film, color filter, manufacturing method of the same, and sold state imaging deviceFUJIFILM CORP·Filed 2014·Application pending·0 cites
- 1358US2023020941A1Composition, thermally conductive material, thermally conductive sheet, and device with thermally conductive layerFUJIFILM CORP·Filed 2022·Application pending·0 cites
- 1457US10633252B2Surface-modified inorganic substance, method for manufacturing same, resin composition, thermally conductive material, and deviceFUJIFILM CORP·Filed 2018·Granted Apr 28, 2020·0 cites·19 claims
- 1556US11945717B2Surface-modified inorganic nitride, composition, thermally conductive material, and device with thermally conductive layerFUJIFILM CORP·Filed 2020·Granted Apr 2, 2024·0 cites·15 claims
- 1653US2022325163A1Composition, thermally conductive sheet, and device with thermally conductive sheetFUJIFILM CORP·Filed 2022·Application pending·0 cites
- 1752US2023099722A1Composition for forming thermally conductive material, thermally conductive material, thermally conductive sheet, and device with thermally conductive layerFUJIFILM CORP·Filed 2022·Application pending·0 cites
- 1850US12421426B2Composition, thermally conductive sheet, and device with thermally conductive layerFUJIFILM CORP·Filed 2021·Granted Sep 23, 2025·0 cites·12 claims
- 1949US2021284788A1Thermally conductive material-forming composition, thermally conductive material, thermally conductive sheet, device with thermally conductive layer, and filmFUJIFILM CORP·Filed 2021·Application pending·0 cites
- 2047US11945718B2Surface-modified inorganic nitride, composition, thermally conductive material, and device with thermally conductive layerFUJIFILM CORP·Filed 2020·Granted Apr 2, 2024·0 cites·20 claims
- 2146US11702578B2Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compoundFUJIFILM CORP·Filed 2020·Granted Jul 18, 2023·0 cites·16 claims
- 2246US11370950B2Surface-modified inorganic nitride, composition, thermally conductive material, and device with thermally conductive layerFUJIFILM CORP·Filed 2020·Granted Jun 28, 2022·0 cites·22 claims
- 2346US2020291174A1Composition, thermally conductive material, device with thermally conductive layer, and method for manufacturing thermally conductive materialFUJIFILE CORP·Filed 2020·Application pending·0 cites
- 2444US10961423B2Curable composition, thermally conductive material, and device with thermally conductive layerFUJIFILM CORP·Filed 2019·Granted Mar 30, 2021·0 cites·21 claims
- 2541US9902794B2Curable composition, optical component and compoundFUJIFILM CORP·Filed 2016·Granted Feb 27, 2018·0 cites·24 claims
- 2640US2011076454A1Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing same, and relief printing plate and process for making sameFUJIFILM CORP·Filed 2010·Application pending·0 cites
- 2740US2018094086A1Near infrared absorbing composition, near infrared cut filter, method of manufacturing near infrared cut filter, device, method of manufacturing copper-containing polymer, and copper-containing polymerFUJIFILM CORP·Filed 2017·Application pending·0 cites
- 2837US2016178816A1Near-infrared-absorbing composition, near-infrared cut filter obtained using same, process for producing said cut filter, camera module and process for producing same, and solid photographing elementFUJIFILM CORP·Filed 2016·Application pending·0 cites
- 2935US2016103247A1Near infrared radiation-absorbing composition, near infrared radiation cut-off filter and production method therefor, and camera module and production method thereforFUJIFILM CORP·Filed 2015·Application pending·0 cites
- 3034US2015293283A1Near-infrared absorbing composition, near-infrared blocking filter, method for producing near-infrared blocking filter, camera module and method for manufacturing camera moduleFUJIFILM CORP·Filed 2015·Application pending·0 cites
- 3132US2015124152A1Near-infrared absorptive composition, near-infrared cut filter using near-infrared absorptive composition, method for manufacturing near-infrared cut filter, and camera module and method for manufacturing camera moduleFUJIFILM CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →