Inventor · disambiguated record
Matthew David Romig
Also filed as: ROMIG MATTHEW · ROMIG MATTHEW D · ROMIG MATTHEW DAVID
32 granted patents·10 pending applications·119 citations·filing 2006–2024
96Inventor score
Files withTEXAS INSTRUMENTS INC32ROMIG MATTHEW D3ROMIG MATTHEW2CHIPALKATTI JAYPRAKASH VIJAY1EDWARDS DARVIN R1
Top patents by PatentIndex Score
42 records- 0196US8299588B1Structure and method for uniform current distribution in power supply moduleTATEISHI TETSUO·Filed 2011·Granted Oct 30, 2012·37 cites·12 claims
- 0295US9647329B2Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguideTEXAS INSTRUMENTS INC·Filed 2014·Granted May 9, 2017·21 cites·11 claims
- 0392US9572261B2Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2015·Granted Feb 14, 2017·8 cites·19 claims
- 0490US12142550B2Multi-chip module leadless packageTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 12, 2024·1 cites·19 claims
- 0589US11538741B2Multi-chip module leadless packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 27, 2022·2 cites·20 claims
- 0688US11669069B2Methods, apparatus, and systems to facilitate multi-channel isolationTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 6, 2023·1 cites·18 claims
- 0788US9842797B2Stacked die power converterTEXAS INSTRUMENTS INC·Filed 2013·Granted Dec 12, 2017·10 cites·10 claims
- 0886US9524926B2Packaged device with additive substrate surface modificationTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 20, 2016·4 cites·3 claims
- 0984US10566276B2Packaged semiconductor system having unidirectional connections to discrete componentsTEXAS INSTRUMENTS INC·Filed 2017·Granted Feb 18, 2020·2 cites·20 claims
- 1084US9780017B2Packaged device with additive substrate surface modificationTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 3, 2017·3 cites·20 claims
- 1181US9496171B2Printed interconnects for semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2015·Granted Nov 15, 2016·3 cites·18 claims
- 1279US11061384B2Methods, apparatus, and systems to facilitate multi-channel isolationTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 13, 2021·1 cites·20 claims
- 1377US11049836B2Bond wire support systems and methodsTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 29, 2021·2 cites·23 claims
- 1477US10516381B23D-printed protective shell structures for stress sensitive circuitsTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 24, 2019·2 cites·19 claims
- 1577US2025022781A1Multi-chip module leadless packageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1676US8723337B2Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrateHOWARD GREGORY E·Filed 2011·Granted May 13, 2014·6 cites·16 claims
- 1772US8816513B2Electronic assembly with three dimensional inkjet printed tracesROMIG MATTHEW DAVID·Filed 2012·Granted Aug 26, 2014·4 cites·15 claims
- 1872US7863738B2Apparatus for connecting integrated circuit chip to power and ground circuitsTEXAS INSTRUMENTS INC·Filed 2007·Granted Jan 4, 2011·4 cites·19 claims
- 1970US8945986B2Electronic assembly with three dimensional inkjet printed tracesTEXAS INSTRUMENTS INC·Filed 2014·Granted Feb 3, 2015·2 cites·7 claims
- 2070US8716068B2Method for contacting agglomerate terminals of semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2013·Granted May 6, 2014·2 cites·17 claims
- 2169US9852979B2Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2016·Granted Dec 26, 2017·1 cites·13 claims
- 2265US8847349B2Integrated circuit package with printed circuit layerTEXAS INSTRUMENTS INC·Filed 2012·Granted Sep 30, 2014·2 cites·1 claims
- 2364US10756013B2Packaged semiconductor system having unidirectional connections to discrete componentsTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 25, 2020·0 cites·19 claims
- 2460US11082028B23D-printed protective shell structures with support columns for stress sensitive circuitsTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 3, 2021·0 cites·19 claims
- 2556US8643165B2Semiconductor device having agglomerate terminalsEDWARDS DARVIN R·Filed 2012·Granted Feb 4, 2014·1 cites·2 claims
- 2654US12243911B2Integrated circuit package for isolation diesTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 4, 2025·0 cites·6 claims
- 2754US9111845B2Integrated circuit package with printed circuit layerTEXAS INSTRUMENTS INC·Filed 2014·Granted Aug 18, 2015·0 cites·13 claims
- 2851US11525739B2Thermistor die-based thermal probeTEXAS INSTRUMENTS INC·Filed 2018·Granted Dec 13, 2022·0 cites·24 claims
- 2951US9679864B2Printed interconnects for semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2016·Granted Jun 13, 2017·0 cites·7 claims
- 3051US9527728B2Integrated circuit package and methodTEXAS INSTRUMENTS INC·Filed 2013·Granted Dec 27, 2016·0 cites·20 claims
- 3149US2011012035A1Method for Precision Symbolization Using Digital Micromirror Device TechnologyTEXAS INSTRUMENTS INC·Filed 2009·Application pending·0 cites
- 3249US2014179064A1Method for fabricating a package-in-package for high heat dissipationTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 3346US9899339B2Discrete device mounted on substrateTEXAS INSTRUMENTS INC·Filed 2012·Granted Feb 20, 2018·0 cites·9 claims
- 3446US2016096727A1Integrated circuit package methodTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
- 3545US2009127700A1Thermal conductor lids for area array packaged multi-chip modules and methods to dissipate heat from multi-chip modulesROMIG MATTHEW·Filed 2007·Application pending·0 cites
- 3642US8298870B2Method for connecting integrated circuit chip to power and ground circuitsROMIG MATTHEW D·Filed 2010·Granted Oct 30, 2012·0 cites·8 claims
- 3742US2010289145A1Wafer chip scale package with center conductive massCHIPALKATTI JAYPRAKASH VIJAY·Filed 2009·Application pending·0 cites
- 3842US2008032454A1Thermally Enhanced BGA Package Substrate Structure and MethodsROMIG MATTHEW·Filed 2006·Application pending·0 cites
- 3940US9768130B2Integrated power packageTEXAS INSTRUMENTS INC·Filed 2015·Granted Sep 19, 2017·0 cites·11 claims
- 4039US2013320514A1Package-in-Package for High Heat Dissipation Having Leadframes and Wire BondsROMIG MATTHEW D·Filed 2012·Application pending·0 cites
- 4136US2017347490A1High-frequency antenna structure with high thermal conductivity and high surface areaTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
- 4235US2008083981A1Thermally Enhanced BGA Packages and MethodsROMIG MATTHEW D·Filed 2006·Application pending·0 cites
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