Assignee
ROMIG MATTHEW
0 granted patents·2 pending applications·0 citations·filing 2006–2007
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0145US2009127700A1Thermal conductor lids for area array packaged multi-chip modules and methods to dissipate heat from multi-chip modulesROMIG MATTHEW·Filed 2007·Application pending·0 cites
- 0242US2008032454A1Thermally Enhanced BGA Package Substrate Structure and MethodsROMIG MATTHEW·Filed 2006·Application pending·0 cites
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