Inventor · disambiguated record
Yukio Sekiya
Also filed as: SEKIYA YUKIO
2 granted patents·206 citations·filing 1996–1996
70Inventor score
Files withFUJITSU LTD2
Top patents by PatentIndex Score
2 records- 0191US5828128ASemiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor deviceFUJITSU LTD·Filed 1996·Granted Oct 27, 1998·160 cites·3 claims
- 0272US5760469ASemiconductor device and semiconductor device mounting boardFUJITSU LTD·Filed 1996·Granted Jun 2, 1998·46 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →