Inventor · disambiguated record
Yasuhiro Teshima
Also filed as: TESHIMA YASUHIRO
13 granted patents·498 citations·filing 1991–2012
93Inventor score
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13 records- 0191US5828128ASemiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor deviceFUJITSU LTD·Filed 1996·Granted Oct 27, 1998·160 cites·3 claims
- 0287US5783865AWiring substrate and semiconductor deviceFUJITSU LTD·Filed 1996·Granted Jul 21, 1998·96 cites·7 claims
- 0386US5593080AMask for printing solder pasteFUJITSU LTD·Filed 1995·Granted Jan 14, 1997·76 cites·12 claims
- 0477US7044763B1SFP module mounting structureFUJITSU LTD·Filed 2005·Granted May 16, 2006·17 cites·10 claims
- 0575US7375429B2Integrated circuit component and mounting method thereofFUJITSU LTD·Filed 2005·Granted May 20, 2008·6 cites·12 claims
- 0675US6655990B2Method of surface mounting a connector and connectorFUJITSU LTD·Filed 2000·Granted Dec 2, 2003·19 cites·1 claims
- 0772US5760469ASemiconductor device and semiconductor device mounting boardFUJITSU LTD·Filed 1996·Granted Jun 2, 1998·46 cites·23 claims
- 0865US6081998AMethod of surface mounting a connectorFUJITSU LTD·Filed 1998·Granted Jul 4, 2000·23 cites·7 claims
- 0964US5413164AHeating furnace in combination with electronic circuit modulesFUJITSU LTD·Filed 1991·Granted May 9, 1995·40 cites·3 claims
- 1050US6444925B1Press-fit pin connection checking method and systemFUJITSU LTD·Filed 2001·Granted Sep 3, 2002·5 cites·10 claims
- 1149US9778647B2Working machine and positional deviation data acquisition methodFUJI MACHINE MFG·Filed 2012·Granted Oct 3, 2017·1 cites·7 claims
- 1241US6038135AWiring board and semiconductor deviceFUJITSU LTD·Filed 1996·Granted Mar 14, 2000·9 cites·13 claims
- 1340US6883157B2BWB transmission wiring design systemFUJITSU LTD·Filed 2002·Granted Apr 19, 2005·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →