Inventor · disambiguated record
Harald Te Nijenhuis
Also filed as: TE NIJENHUIS HARALD
10 granted patents·4 pending applications·503 citations·filing 2000–2024
91Inventor score
Files withLAM RES CORP4NOVELLUS SYSTEMS INC3MOHN JONATHAN D2DRAEGER NERISSA1NITTALA LAKSHMINARAYANA1
Top patents by PatentIndex Score
14 records- 0196US7981763B1Atomic layer removal for high aspect ratio gapfillNOVELLUS SYSTEMS INC·Filed 2008·Granted Jul 19, 2011·59 cites·18 claims
- 0295US8133797B2Protective layer to enable damage free gap fillVAN SCHRAVENDIJK BART·Filed 2008·Granted Mar 13, 2012·78 cites·23 claims
- 0395US8058179B1Atomic layer removal process with higher etch amountDRAEGER NERISSA·Filed 2008·Granted Nov 15, 2011·286 cites·17 claims
- 0493US9719169B2System and apparatus for flowable deposition in semiconductor fabricationMOHN JONATHAN D·Filed 2011·Granted Aug 1, 2017·31 cites·18 claims
- 0592US9847222B2Treatment for flowable dielectric deposition on substrate surfacesLAM RES CORP·Filed 2014·Granted Dec 19, 2017·15 cites·21 claims
- 0692US9728380B2Dual-plenum showerhead with interleaved plenum sub-volumesNOVELLUS SYSTEMS INC·Filed 2015·Granted Aug 8, 2017·11 cites·20 claims
- 0787US9121097B2Variable showerhead flow by varying internal baffle conductanceMOHN JONATHAN D·Filed 2012·Granted Sep 1, 2015·10 cites·23 claims
- 0877US2025137125A1Vapor accumulator for corrosive gases with purgingLAM RES CORP·Filed 2024·Application pending·0 cites
- 0969US6541400B1Process for CVD deposition of fluorinated silicon glass layer on semiconductor waferNOVELLUS SYSTEMS INC·Filed 2000·Granted Apr 1, 2003·13 cites·22 claims
- 1060US12227842B2Vapor accumulator for corrosive gases with purgingLAM RES CORP·Filed 2020·Granted Feb 18, 2025·0 cites·22 claims
- 1158US10107490B2Configurable liquid precursor vaporizerLAM RES CORP·Filed 2014·Granted Oct 23, 2018·0 cites·18 claims
- 1252US2015118848A1Atomic layer removal process with higher etch amountNOVELLUS SYSTEM INC·Filed 2014·Application pending·0 cites
- 1340US2014049162A1Defect reduction in plasma processingTHOMAS GEORGE·Filed 2012·Application pending·0 cites
- 1434US2012149213A1Bottom up fill in high aspect ratio trenchesNITTALA LAKSHMINARAYANA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →