Inventor · disambiguated record
Cheng-Pin Chien
Also filed as: CHIEN CHENG-PIN
1 granted patent·1 pending application·6 citations·filing 2009–2009
28Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0169US8049114B2Package substrate with a cavity, semiconductor package and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Nov 1, 2011·6 cites·4 claims
- 0239US2010206619A1Package substrate strucutre with cavity and method for making the sameCHEN KUO-CHING·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →